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Indium Corporation’s New Type 6 Jetting Solder Paste Hits Market

06/26/2024 | Indium Corporation
Indium Corporation® is pleased to introduce a new jetting solder paste to join its PicoShot® series of products. PicoShot® NC-6M is a no-clean, halogen-free, Type 6 powder-size material specifically formulated to be compatible with Mycronic jetting systems and Mycronic’s “small dot” ejector.

Forty Years of Innovation at Electra Polymer

06/26/2024 | Marcy LaRont, PCB007 Magazine
In this engaging interview, Don Monn, national sales manager at Electra Polymers, talks about the company's 40th anniversary and recent developments in inkjet solder mask technology. Don shares insights on the company’s history, commitment to innovation, and the environmental benefits of its products. He discusses the challenges and advancements in the circuit board industry since the 1990s, emphasizing the importance of education and mentorship. The conversation highlights Electra's strategic investments and their confidence in future growth.

Scanfil Helps with KIS Evo Booth Visualization

06/26/2024 | Scanfil
Together with KIS (part of the ME Group), one of Scanfil’s key customers in Myslowice Poland, we wanted to bring the product to life and show how complex a photo booth can be.

Keysight Streamlines and Automates Samsung Semiconductor India Research’s 5G Field-to-Lab Workflow

06/26/2024 | BUSINESS WIRE
Keysight Technologies, Inc. announces that Samsung Semiconductor India Research (SSIR) has selected the Keysight Signaling Field-To-Lab (S-FTL) solution to streamline and automate its 5G field-to-lab workflow in its Bengaluru lab.

Space Engine Systems Announces Partnership With ASEI (USA) to Develop Hypersonic Solutions for Missiles

06/26/2024 | BUSINESS WIRE
Space Engine Systems (SES), following on its success in securing a place in UK MoD’s Hypersonic Technology and Capability Development Framework (HTCDF), is pleased to announce a partnership with Applied Systems Engineering Inc (ASEI) of the US.
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