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MacDermid Alpha Electronics Solutions, a leader in integrated technologies and materials for the electronics industry, is set to showcase advanced solutions for die, package, and top-side attach at PCIM Europe. Held at the Nuremberg Exhibition Grounds from June 11 to 13, MacDermid Alpha’s expertise and product portfolio will be on display in Hall 7, Booth 460.
Argomax AccuLam, a breakthrough product for silver sintering that delivers both higher throughput and larger area lamination compatibility, will be highlighted. This technology can also be tailored to specific production requirements.
Maurizio Fenech, MacDermid Alpha’s Director of R&D, Applications, states “With Argomax AccuLam, an engineer can design processes to sinter on a substrate, using a film that has exact dimensions as the die, no overprinting, no un-sintered material, and no waste of sinter paste. Combined, they offer improved production yields together with the reliability that comes along with an Argomax sintered joint.
Research shows that a combination of harsh operating conditions, increased power densities, and miniaturization adds to the complexity of assembly designs in automotive electronics. Addressing these challenges, MacDermid Alpha’s experts, including Kentaro Yoshioka and Robert Graham, will present papers on improving the consistency of sintered joints and enabling higher component operating temperatures. Gustavo Greca, Director Global Power Electronics Business Development at MacDermid Alpha, will highlight sintering materials on the exhibition stage at the event on June 11 starting at 14:35 CEST.
Explore MacDermid Alpha’s broad range of high-performing products and processes for the power electronic industry. See us at PCIM Europe, Booth 7-460.
