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ASMPT Presents Die Bonder with Intelligent Features

05/14/2025 | ASMPT
ASMPT, the leading supplier of production equipment for advanced packaging and semiconductor assembly, introduces its flagship INFINITE bonder, which achieves top performance in throughput and quality.

SAA and ASMPT Honored with Technica USA’s 2024 Supplier Alliance Awards

04/15/2025 | Technica USA
Technica USA was pleased to announce the recipients of its 2024 Supplier Alliance Awards, presented at the 2025 IPC/APEX Expo in Anaheim, California. These prestigious awards recognize outstanding suppliers in the PCB fabrication and PCB assembly sectors, honoring those who go above and beyond in aligning their resources, initiatives, and expertise with Technica’s mission to achieve unparalleled success.

Dr. Thomas Marktscheffel of ASMPT Honored for his Work on Open Interfaces

03/25/2025 | ASMPT
Dr. Thomas Marktscheffel, Director Product Management Software Solutions at ASMPT, was honored by the IPC at this year's IPC APEX EXPO in Anaheim, California, for his many years of commitment to the organization. The non-proprietary interface standards he helped develop form the basis for ASMPT’s intelligent factory concept.

ASMPT at the Optical Fiber Communication Conference and Exposition (OFC)

03/24/2025 | ASMPT
ASMPT, the world’s leading provider of pioneering solutions for advanced packaging and semiconductor assembly, will present its pioneering AMICRA NANO, AMICRA NOVA PRO and MEGA bonding solutions at the ASMPT booth 5675 during the OFC 2025 trade event being held April 1-3 at the Moscone Center in San Francisco, California (USA).

ASMPT Strengthens its Global Footprint

03/21/2025 | ASMPT
ASMPT, the global market and technology leader for hardware and software solutions in the semiconductor and electronics industries, continues to drive the growth of its semiconductor solutions in strategically important markets.
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