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Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 2

07/10/2024 | I-Connect007 Editorial Team
The evolution of low-temperature solder alloys requires thoughtful consideration of the thermal and mechanical reliability requirements specific to each application. Thermal cycling and drop (mechanical) shock tests have long been used as board-level proxy tests for evaluating and quantifying the ability of electronics assemblies to sustain abrupt, short-term mechanical stresses, as well as continuous cyclic stresses.

Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste

06/14/2024 | Indium Corporation
Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology.

Technology Days 2024 at Rehm: #opentochange

06/14/2024 | Rehm Thermal Systems
“The only constant is change” – this is particularly true in electronics manufacturing. In an industry that is constantly evolving and changing, it is crucial to be open to change.

International Promotion of Young Talents – Rehm Thermal Systems Welcomes Dual Students from GIP CEI / ESTI in Redon, France

06/14/2024 | Rehm Thermal Systems
In order to inspire qualified specialists to work in an industrial company, it is important to present yourself as a sustainable and innovative company with development opportunities:

Indium to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium

06/05/2024 | Indium Corporation
Indium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.
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