The Marketing Minute: Marketing With Layers
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
It’s Only Common Sense: If You’re Not Differentiated, You’re Dead
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 7, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
It’s been a great week. I spent part of the week at PCB East, which was held at the Boxboro Regency in Boxboro, Massachusetts. I haven’t been to Boxboro in about 20 years. The last time I was at PCB East in Boxboro, design instructor Mary Sugden had a hot plate and a supply of bologna in her room, because she preferred fried bologna to anything she could get in a restaurant. Never a dull moment with PCB designers!
PCB East has been growing since it re-opened a few years ago. The conference was well attended, and Wednesday’s expo was busy all day long. These one-day tabletop shows are the way to go, as we’ve seen lately with the success of SMTA’s local shows. I’ll have a post-show write-up next week.
But I’m glad to be home. Here’s a roundup of this week’s top news as you head into the weekend.
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Published December 8
Technology Editor Happy Holden has been following the growing development of “bend-to-install” or “semi-flex” materials. In this update, Happy breaks down the details of this process, which, unlike flexible circuits, utilizes standard FR-4 materials and processes. We’re seeing a lot of “hybrid” processes like this now, and we’ll continue to follow this technology.
My Experience as an International Student
Published June 5
It must be really stressful being an international student; I had a hard enough time graduating from college in the country where I was born. But Palash Vyas is a little more of a go-getter than I was, to say the least. In this article, the recent doctoral graduate outlines his path from Mumbai to Auburn University, his volunteer efforts with IPC and SMTA, and winner of Best Poster Award at this year’s IPC APEX EXPO.
The Pulse: Overconstraining: Short, Slim, and Smooth
Published June 6
As columnist Martyn Gaudion says, small is beautiful in high-speed design and high reliability. To avoid overconstraining your high-speed board, Martyn explains why keeping things “short, slim, and smooth” are watchwords and why designers must take cost and DFM into account with each design.
Has It Really Been Survival Mode?
Published June 6
This is a topic that we’ve been hearing about for years: Companies in the EMS industry that are doing well have done so by being in “survival mode” for years. But is that really the case? Mark Wolfe examines this issue, starting with the four questions that each EMS manager answers before accepting every job.
Advancing PCB Technology: A Conversation With John Johnson
Published June 4
In this audio interview, John Johnson of American Standard Circuit discusses the industry’s continued movement toward finer lines and spaces and additive processes, as well as the need for a “mindset shift” and training in order to meet the needs of this new technology. He also discusses the need to focus on cleanliness and material adhesion with ultra-fine lines.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns
10/14/2025 | I-Connect007 Editorial TeamThe Dutch government has taken control of Chinese-owned chipmaker Nexperia, escalating tensions with Beijing amid intensifying global disputes over semiconductor technology and intellectual property.
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
The Right Approach: Electro-Tek—A Williams Family Legacy, Part 1
10/15/2025 | Steve Williams -- Column: The Right ApproachThere is no bronze bust in the lobby or portrait in the conference room of Electro-Tek's founder—my Dad, Charles “Chuck” Williams—so with the facility closing last year after 56 years, I feel it is time to tell the story. Chuck Williams founded Electro-Tek in 1968 in our basement, eventually moving into the second floor of an old 1913 building in downtown Milwaukee that is still standing (the first of three eventual facilities).
ICT Symposium Review: Sustainability and the Circular Economy
10/09/2025 | Pete Starkey, I-Connect007It was pleasant autumnal weather as we made our way once again to Meriden, the nominal centre of England, for the 2025 Annual Symposium of the Institute of Circuit Technology. Delegates were welcomed by technical director Emma Hudson who introduced and moderated a skilfully coordinated programme, focused on the highly relevant theme of sustainability.
Taiwan Rejects U.S. Proposal for 50-50 Semiconductor Production Split
10/03/2025 | I-Connect007 Editorial TeamTaiwan stated on October 1 that it will not agree to a U.S. proposal to shift half of its semiconductor production to the United States, despite mounting pressure from Washington over tariffs and chip supply security, according to Reuters.