The Big Picture: Our Big ‘Why’ in the Age of AI
The Chemical Connection: Through-glass Vias in Glass Substrates
It’s Only Common Sense: Why Sales Teams Fail (and How to Fix Them)
Rogers Expands Capabilities and Services With New Application Laboratory
June 12, 2024 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation announced that the new application laboratory was completed, expanding the company's assembly, testing and inspection capabilities and services at the curamik® production site in Eschenbach. The establishment of the application laboratory started in 2023 by building a cleanroom facility inside an infrastructure at Gossenstrasse 45 in Eschenbach, followed by equipment sourcing and acquisition. The cleanroom was completed mid December 2023 with the delivery and installation of the acquired machines.
Rogers Expands Capabilities and Services with New Application Laboratory
The application laboratory allows Rogers to explore strategic partnerships with well-known, established manufacturers and suppliers in the industry with short lead times and capable lab equipment at a minimal cost. Establishing an in-house application laboratory meets the markets' and our customers' demand for quick and efficient support. The application laboratory has an 110m2 floor area that houses the equipment and with provision for next steps equipment’s for expansion, equipped with climate control to maintain temperature inside for equipment operational requirement and this is an ESD “Electro-static discharge” controlled area. Furthermore, it fulfils the ISO7 standard for a certified cleanroom facility.
In the application laboratory the following machines are available for assembly:
- Stencil Printer
- Vacuum Soldering System
- Die Attach
- Sintering Press
- Wirebonder
- Centrifugal Mixer
Moreover, a wide range of testing and inspection machines are available, such as:
- Thermal Resistance / Impedance Tester
- Hi-pot and Power Supplies
- Bending Fixture
- 3D Optical Profilometer
- Video Microscope
The focus of the application laboratory is to validate our products' value proposition for our customers and to offer key customers workability testing by request. Moreover, it allows us to evaluate new and emerging materials and process compatibilities to understand upfront our product performance. Rogers laboratory equipment and added services enhance our technical support capabilities for our customers and further differentiate Rogers from our competitors.
Become a Member of the Design Support Hub
Rogers brings its more than 40 years of experience with power electronics solutions together in a handy online resource that is available 24/7. The Advanced Electronics Solutions (AES) Design Support Hub features complete technical information on ROLINX® busbars, capacitor busbar assemblies and curamik® ceramic substrates, a library of technical papers on product design and problem solving and helpful videos on products and power distribution topics. Registration for access is quick and free of charge.
Share on:
Suggested Items
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
MVTec, Siemens Expand Technological Cooperation
06/12/2025 | MVTecMVTec Software GmbH and Siemens are expanding their technological cooperation in the field of industrial automation. To reinforce their increasingly close collaboration, Siemens joined the MVTec Technology Partner Program in May 2025.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology, Inc. That Achieves Yields Greater Than 99% for Underfilling During Semiconductor Manufacturing
06/11/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case, Nordson’s customer, Powertech Technology, Inc. (PTI) saw underfill yields improve to greater than 99% as they plan to transition from wafers to panels in their manufacturing operations. edwd
ACCM Joins Polar’s Speedstack Material Partner Program
06/10/2025 | Polar InstrumentsAdvance Chip & Circuit Materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain.