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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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eCADSTAR Sets New Standards for Compact PCB Design with Etched Inductor Parts
June 12, 2024 | ZukenEstimated reading time: 2 minutes
Zuken announces the 2024 release of eCADSTAR, Zuken’s next-generation PCB design system for small and medium businesses. The new release includes a number of improvements ranging from enhanced design reuse, simplified revision tracking and more robust schematic design.
eCADSTAR 2024 supports PCB designers in meeting the increasing demand for compact, high-performance, energy-efficient, and environmentally friendly electronic devices. Addressing the challenge of limited PCB space, the 2024 release optimizes the placement of etched resistors on inner layers, essential for the termination of critica signals. The intuitive footprint editor allows for easy customization of size and shape, ensuring accurate resistance values and enhancing design efficiency.
Design Comparison Capability for Revision Tracking
The new release introduces a comprehensive design comparison capability that allows designers to easily identify differences between two PCB or schematic designs. This feature is invaluable for understanding revisions made over time, especially when the documentation of
changes is deficient. In addition, the shape comparison tool aids in reverse engineering efforts by highlighting discrepancies in copper and routing patterns.
Efficient Component Transfer
The new "Copy Complete Part" feature allows designers to effortlessly transfer a component, along with its comprehensive set of data including PCB footprint, schematic symbol, padstacks, and 3D model, from a customer-specific or prototype library to a central library directly to a customer-specific library in a single action. This capability not only saves valuable time, but also ensures consistency and accuracy in the design process - a significant improvement over the piece-by-piece transfer processes of the past.
Schematic Updates for Improved Design Experience
eCADSTAR Schematic has received several updates to improve the design experience. The documentation enhancements now include support for variant text. The drawing of nets and buses has been optimized to make the process of connecting components much easier. In addition, the introduction of new Design Rule Checks (DRCs) helps identify potential problems early on, streamlining the design process, reducing overall design time, and minimizing the need for later revisions.
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Punching Out: How Are the Big Boys in Electronics Doing?
05/12/2026 | Tom Kastner -- Column: Punching Out!Let’s see what the public companies are up to in the PCB and EMS industries. In North America, there are only a couple of publicly traded PCB companies: TTM Technologies and Firan Technology Group. On the EMS side, there are a few more: Flex, Jabil, Celestica, Sanmina,, Benchmark, Fabrinet, Kimball Electronics, Plexus Corp, Nortech Systems, and Key Tronic Corp. From an M&A standpoint, these public companies have been fairly quiet in the past five years. FTG completed two deals in 2022 (IMI and Holaday), Flex had three deals, Jabil had five deals, and Sanmina had one deal.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.