-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
eCADSTAR Sets New Standards for Compact PCB Design with Etched Inductor Parts
June 12, 2024 | ZukenEstimated reading time: 1 minute

Zuken announces the 2024 release of eCADSTAR, Zuken’s next-generation PCB design system for small and medium businesses. The new release includes a number of improvements ranging from enhanced design reuse, simplified revision tracking and more robust schematic design.
eCADSTAR 2024 supports PCB designers in meeting the increasing demand for compact, high-performance, energy-efficient, and environmentally friendly electronic devices. Addressing the challenge of limited PCB space, the 2024 release optimizes the placement of etched resistors on inner layers, essential for the termination of critica signals. The intuitive footprint editor allows for easy customization of size and shape, ensuring accurate resistance values and enhancing design efficiency.
Design Comparison Capability for Revision Tracking
The new release introduces a comprehensive design comparison capability that allows designers to easily identify differences between two PCB or schematic designs. This feature is invaluable for understanding revisions made over time, especially when the documentation of
changes is deficient. In addition, the shape comparison tool aids in reverse engineering efforts by highlighting discrepancies in copper and routing patterns.
Efficient Component Transfer
The new "Copy Complete Part" feature allows designers to effortlessly transfer a component, along with its comprehensive set of data including PCB footprint, schematic symbol, padstacks, and 3D model, from a customer-specific or prototype library to a central library directly to a customer-specific library in a single action. This capability not only saves valuable time, but also ensures consistency and accuracy in the design process - a significant improvement over the piece-by-piece transfer processes of the past.
Schematic Updates for Improved Design Experience
eCADSTAR Schematic has received several updates to improve the design experience. The documentation enhancements now include support for variant text. The drawing of nets and buses has been optimized to make the process of connecting components much easier. In addition, the introduction of new Design Rule Checks (DRCs) helps identify potential problems early on, streamlining the design process, reducing overall design time, and minimizing the need for later revisions.
Suggested Items
Flexible PCB Market to Reach $61.75B by 2032, Driven by the Demand for Compact Electronics, Automotive and Medical Applications
05/16/2025 | Globe NewswireAccording to the SNS Insider, “The Flexible PCB Market was valued at USD 21.42 billion in 2023 and is expected to reach $61.75 billion by 2032, growing at a CAGR of 12.52% over the forecast period 2024-2032.”
The ICAPE Group Announces a 13% Growth in Revenue to €51.1M for Q1 2025
05/15/2025 | ICAPE GroupThe ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, announced its sales for the first quarter of 2025.
Interlink Electronics Reports Q1 2025 Result
05/15/2025 | BUSINESS WIREInterlink Electronics, Inc., a global leader in sensor technology and printed electronic solutions, reported results for the first quarter ended March 31, 2025.
In Pursuit of Perfection: Defect Reduction—May 2025 PCB007 Magazine Now Available
05/15/2025 | I-Connect007 Editorial TeamFor bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In the May 2025 issue of PCB007 Magazine, we examine the imaging, etching, and plating processes, as well as product traceability on the shop floor, providing information and insight into how you can reduce your defects and increase yields.
indie Semiconductor Reports Q1 2025 Results
05/13/2025 | BUSINESS WIREindie Semiconductor, Inc., an automotive solutions innovator, today announced first quarter results for the period ended March 31, 2025. Q1 revenue was up 3.3 percent year-over-year to $54.1 million with Non-GAAP gross margin of 49.5 percent. On a GAAP basis, first quarter 2025 operating loss was $38.9 million compared to $49.6 million a year ago.