Elementary, Mr. Watson: Cultivating a Culture of Collaboration
Connect the Dots: Designing for Reality—Lamination and Materials
Tim’s Takeaways: One for the ArchivesIndium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste
June 14, 2024 | Indium CorporationEstimated reading time: Less than a minute
Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology. Durafuse® HR is a patent-pending alloy system that delivers enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications.
Engineered to withstand 3,000+ thermal cycles at -40°C/125°C across different PCB finishes and component types, Durafuse® HR is ideal for applications requiring an extended mission profile beyond what is achievable with traditional Pb-free alloys. No longer does high-reliability have to mean high-voiding, as Durafuse® HR outperforms SAC305 when it comes to bottom-terminated component voiding. It also offers reduced solder joint cracking and increased shear strength.
“At Indium Corporation, we believe that materials science changes the world,” said Senior Product Manager Chris Nash. “In that spirit, we believe that Durafuse® HR has the ability to revolutionize automotive soldering processes and numerous other high-reliability applications.”
Durafuse HR features:
- High-temperature thermal cycling reliability
- Excellent voiding performance
- Good shear strength
- Compatible with most SAC305 reflow profiles
- Compatible with standard PCB surface finishes, including ImSn, OSP, and ENIG
Share on:
Suggested Items
Indium to Host Free Webinar on Lead-Free Solder Paste for Automotive Applications
04/09/2024 | Indium CorporationIndium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.
Indium Expert to Present on Unique High-Reliability Alloy Technologies at IEMT
09/23/2022 | Indium CorporationIndium Corporation will share its industry knowledge and expertise on topics including high-temperature lead-free solder pastes for power discrete applications, and low-temperature solder pastes for wafer-level packaging applications, during two presentations at the International Electronics Manufacturing Technology (IEMT) conference, Oct. 19-21, Putrajaya, Malaysia.
Indium’s Jason Chou to Present at SEMICON Taiwan
08/16/2022 | Indium CorporationIndium Corporation senior area technical manager, Jason Chou, will present on low-temperature solders at SEMICON Taiwan’s TechXPOT on Thursday, September 15, in Taipei, Taiwan.
Indium to Showcase Durafuse Technology at EPP InnovationsFORUM
06/01/2022 | Indium CorporationIndium Corporation will showcase its innovative Durafuse technology at the EPP InnovationsFORUM on Tuesday, June 28 in Leinfelden-Echterdingen, Germany.
Indium Corporation to Feature Innovative New Alloy at IPC APEX Expo 2020
12/03/2019 | Indium CorporationIndium Corporation will feature its new high-performance, high-reliability alloy technology at IPC APEX Expo, February 4-6, in San Diego, Calif., USA.