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Indium Corporation Introduces Cutting-Edge, High-Reliability Alloy for Solder Paste
June 14, 2024 | Indium CorporationEstimated reading time: Less than a minute

Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company’s Durafuse mixed-alloy technology. Durafuse® HR is a patent-pending alloy system that delivers enhanced thermal cycling performance and superior voiding performance without vacuum reflow, especially for high-reliability automotive applications.
Engineered to withstand 3,000+ thermal cycles at -40°C/125°C across different PCB finishes and component types, Durafuse® HR is ideal for applications requiring an extended mission profile beyond what is achievable with traditional Pb-free alloys. No longer does high-reliability have to mean high-voiding, as Durafuse® HR outperforms SAC305 when it comes to bottom-terminated component voiding. It also offers reduced solder joint cracking and increased shear strength.
“At Indium Corporation, we believe that materials science changes the world,” said Senior Product Manager Chris Nash. “In that spirit, we believe that Durafuse® HR has the ability to revolutionize automotive soldering processes and numerous other high-reliability applications.”
Durafuse HR features:
- High-temperature thermal cycling reliability
- Excellent voiding performance
- Good shear strength
- Compatible with most SAC305 reflow profiles
- Compatible with standard PCB surface finishes, including ImSn, OSP, and ENIG
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05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
Indium to Showcase Durafuse Solder Technology at NEPCON Japan
01/21/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
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Indium to Host Free Webinar on Lead-Free Solder Paste for Automotive Applications
04/09/2024 | Indium CorporationIndium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.
Indium Expert to Present on Unique High-Reliability Alloy Technologies at IEMT
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