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08/12/2026 | PRNewswire
Lam Research Corp. and New York Center for Research, Economic Advancement, Technology, Engineering and Science (NY Creates) announced a collaboration to enable the training of approximately 3,500 students in semiconductor process integration over the next five years.

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IMAPS Enhances IMAPS Academy

08/04/2026 | IMAPS
The International Microelectronics Assembly and Packaging Society (IMAPS), the leading organization dedicated to advancing microelectronics and electronics packaging, is pleased to announce the updated IMAPS Academy—an enhanced online training platform designed to address the industry's growing workforce development needs.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/19/2026 | Michelle Te, I-Connect007
Why do so many students who begin college intending to pursue STEM careers ultimately change direction? According to research highlighted by Malcolm Gladwell, the answer often has less to do with ability than perseverance. That spirit of continuous learning is reflected in my must-reads for the week, from major industry investments and policy developments to conferences, publications, and tools designed to help engineers improve their craft. Be sure to read the June issues of I-Connect007 Magazine and the Advanced Electronics Packaging Digest, which both published this week. They serve as a reminder that innovation depends not only on technology, but also on the people willing to keep learning and growing throughout their careers.

European Chips Skills Academy Launches the ECSA Learning Platform

04/07/2026 | SEMI
The European Chips Skills Academy (ECSA), an European Union (EU)-funded initiative coordinated by SEMI Europe, announced the official launch of its ECSA Learning Platform, a new digital hub with a full suite of training courses designed to support the development of semiconductor skills across Europe.
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