-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Exhibitor Registration Opens for 2024 NEDME Expo
June 17, 2024 | NEDMEEstimated reading time: 1 minute
The Electronics Manufacturers Association of Oregon (EMA) and the Electronics Representatives Association (ERA) are delighted to announce that Exhibitor registration for the 2024 NW Electronics Design & Manufacturing Expo (NEDME) is now open. The expo will take place on Wednesday, October 30, 2024, from 8:00 AM to 4:00 PM at the Wingspan Event & Conference Center at Westside Commons in Hillsboro, Oregon. This is the first year that the event will be held at this newer, larger event center.
NEDME stands as the Pacific Northwest’s premier event for electronics manufacturing professionals, offering a unique opportunity to explore the latest industry trends and innovations. The event will feature dynamic exhibits, insightful keynote presentations, technical sessions, and ample networking opportunities, making it an essential gathering for anyone involved in the electronics sector.
Those interested in exhibiting can reserve booth space by registering at www.nedme.com or contacting the EMA at board@nedme.com. Sponsorship opportunities are also available for companies looking to enhance their visibility within the manufacturing community. Lock in your booth now.
Start spreading the news that registration for attendance will open soon, an opportunity to see what NEDME is all about and to connect, learn, and drive innovation in the electronics industry. As always NEDME has a long standing tradition of donating a portion of the proceeds from admissions to the Oregon Food Bank.
Event Details:
- Date: Wednesday, October 30, 2024
- Time: 8:00 AM – 4:00 PM
- Location: Wingspan Event & Conference Center at Westside Commons, Hillsboro, Oregon
We look forward to seeing you there!
Contact Information:
- Exhibitors and Sponsorships: board@nedme.com
- Website: www.nedme.com
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.