-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Bold Breakthroughs: Women Reshaping the Engineering Landscape
June 19, 2024 | IPCEstimated reading time: 1 minute

IPC is shining a spotlight on the incredible women in the electronics industry who are breaking barriers, making bold breakthroughs, and paving the way for future generations. They're not just engineers – they're innovators, problem-solvers, and trailblazers who are transforming the field in ways never seen before.
Join IPC on June 24 at 10:00 am EDT for a special virtual event, "Bold Breakthroughs: Women Reshaping the Engineering Landscape," as we celebrate International Women in Engineering Day (INWED). Our lineup of panelists features eight extraordinary women from all different countries, each a leader in her own right within the electronics industry:
- Susann Chen, Senior Engineer, Zhuzhou CRRC Times Electric Co. (China)
- Savita Ganjigatti, Vice President, Engineering, Sienna ECAD Technologies (India)
- Milea Kammer, Senior Engineering Manager – Materials Engineering, Honeywell Aerospace (United States)
- Susan Kayesar, PCBflow Product Manager, Siemens Digital Industries Software (Israel)
- Carol Marsh, Head of Digital Systems, Celestia Technologies (United Kingdom)
- Raquel Rodriguez, CEO, INSYTE SA (Spain)
- Outi Rusanen, Principal Interconnection Specialist, TactoTek (Finland)
- Corina Stocker, Senior Expert Press-fit Technology, Continental Automotive Technologies (Germany)
Emcee: IPC’s Teresa Rowe, Senior Director, Assembly & Standards Technology
Get ready to hear firsthand about:
- Their inspiring engineering journey
- Their proudest accomplishment
- One invaluable piece of advice (or a lesson learned)
Meet the faces behind the feats — this is your chance to connect with these trailblazing women, learn from their experiences, and chart your own path to success.
Don't miss out on this empowering event and get ready to be inspired like never before! Together, let's celebrate the unstoppable force of female engineers and ignite a new era of innovation.
Visit IPC's website for more information and to register for this event.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
HyRel Technologies Showcases Summer Intern Success Through Hands-On Innovation
09/16/2025 | HyRel TechnologiesHyRel Technologies, a global provider of quick turn semiconductor modification solutions, proudly highlights the accomplishments of its two recent summer interns, Danny Hoang and Nisarg Jadav.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
Cadence to Acquire Hexagon’s Design & Engineering Business
09/08/2025 | Cadence Design SystemsCadence announced it has entered into a definitive agreement to acquire the Design & Engineering (D&E) business of Hexagon AB, which includes its MSC Software business—a pioneer in engineering simulation and analysis solutions.