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OSI Systems Receives $10 Million Order for RTT 110 Hold Baggage Screening Systems
June 21, 2024 | BUSINESS WIREEstimated reading time: Less than a minute
OSI Systems, Inc. announced that its Security division received an order for approximately $10 million to provide multiple units of its RTT® 110 (Real Time Tomography) explosive detection system to screen passengers’ hold (checked) baggage at an international airport in Latin America. The Company is also expected to provide ongoing maintenance, service, and support.
OSI Systems’ Chairman and CEO, Deepak Chopra, commented, “We are proud to support this airport in enhancing its baggage screening capabilities with our RTT® 110 system. As global airports strive to meet the latest security standards and boost operational efficiency, our dedication to innovation and advanced technology uniquely positions us to address these evolving challenges effectively.”
The RTT® employs a proprietary stationary gantry approach to provide high-resolution 3-D imaging. Its unique design allows the efficient inspection of hold baggage and air cargo while maintaining the capability to meet recent threat detection standards employed by various civil aviation authorities worldwide.
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Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.