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Advanced Electronics Packaging Digest

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Suggested Items

Learning With Leo: Soldering—The Interpretation Problem

06/30/2026 | Leo Lambert -- Column: Learning With Leo
At EPTAC, we operate the largest electronics training facility in the United States, and that gives us a vantage point few others have. I’ve spent most of my career on the training floor and in the rooms where IPC standards get written and revised. Every week, engineers, operators, inspectors, and quality teams come to us from across the country and across industries for help, and they bring their toughest questions. On the surface, they’re asking about toe fillets, gold plating, or rework limits. But underneath those questions is something more important: uncertainty about reliability.

Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders

10/08/2025 | I-Connect007
In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.

ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging

09/03/2025 | ASMPT
ASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.

SMTA Releases Final Batch of Training Resources Donated by Bob Willis

05/29/2025 | SMTA
The Surface Mount Technology Association (SMTA) announces the release of several more webinars, poster sets, and photo libraries to conclude a generous donation from renowned industry expert Bob Willis.

ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing

05/26/2025 | ClassOne Technology
ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging.
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