Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
MacDermid Alpha Electronics Solutions Launches MICROFAB SC-40 PLUS
June 28, 2024 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions Launches MICROFAB® SC-40 PLUS to meet the latest advancements in semiconductor manufacturing.
MICROFAB SC-40 PLUS represents a leap forward in semiconductor manufacturing with a transformative solution addressing demands for increased miniaturization and advanced packaging for artificial intelligence (AI), the internet of things (IoT), and mobile devices. This technology combines precision, efficiency, and ease of use, allowing fabricators to meet the industry’s requirements for high performance and enhanced reliability in advanced applications.
With high-speed plating capabilities of up to 2.5 µm/min, MICROFAB SC-40 PLUS provides a high-purity deposit with superior within-wafer, within-die, and within-feature uniformity, delivering high reliability and optimized process cost for semiconductor fabricators. The versatile chemistry is suitable for bump, pillar, and RDL metallization while also compatible with and without a nickel barrier process for Kirkendall void (KV) free stacks.
"MICROFAB SC-40 PLUS is a significant advancement in semiconductor manufacturing," explains Ashley Kuppersmith, Product Manager – Wafer Level Packaging at MacDermid Alpha. "It offers the industry a transformative solution that seamlessly integrates precision, efficiency, and ease of use. This innovative copper pillar plating process is a versatile product that can accommodate a wide variety of technological applications. MICROFAB SC-40 PLUS’ unique chemistry ensures high-purity and high-speed plating facilitating uniformity and reliability across advanced packaging solutions. Semiconductor fabricators can streamline their processes and achieve unparalleled results, ushering in a new era of semiconductor fabrication with MICROFAB SC-40 PLUS."
MacDermid Alpha’s MICROFAB SC product range encompasses products and processes that have supported the semiconductor industry for over 10 years.
Share on:
Suggested Items
SEMI ISS Europe 2025 Opens Tomorrow to Highlight AI, Sustainability, and Semiconductor Supply Resilience
03/11/2025 | SEMIThe SEMI Industry Strategy Symposium Europe (ISS Europe) 2025 is set to open tomorrow in Sopot, Poland, bringing together top executives, industry experts, policymakers, and thought leaders to delve into how Europe can leverage AI-driven innovation to enhance its global competitiveness.
European Chips Diversity Alliance Hosts Future Proofing Access to Diverse Talent Event to Strengthen Semiconductor Workforce
03/10/2025 | SEMIThe European Chips Diversity Alliance (ECDA), a European Union-funded initiative coordinated by SEMI Europe, today announced a full-day event on March 27 dedicated to advancing underrepresented groups in the semiconductor industry in collaboration with Learnovate, MIDAS Ireland, and EudaOrg.
SIA Applauds TSMC’s Expanded Investment in U.S. Semiconductor Manufacturing
03/10/2025 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from President and CEO John Neuffer regarding the announcement this week by C.C. Wei of TSMC and President Trump.
Global Semiconductor Sales Increase 17.9% Year-to-Year in January
03/07/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales hit $56.5 billion during the month of January 2025, an increase of 17.9% compared to the January 2024 total of $47.9 billion and 1.7% less than the December 2024 total of $57.5 billion.
Teradyne Announces Succession Plan for Semiconductor Test Division
03/07/2025 | BUSINESS WIRETeradyne, Inc. announced that Shannon Poulin has joined Teradyne to succeed Rick Burns as President of the Semiconductor Test Division in Q2 2025. Mr. Burns plans to retire on June 1, 2025.