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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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European Chips Diversity Alliance Hosts Future Proofing Access to Diverse Talent Event to Strengthen Semiconductor Workforce
March 10, 2025 | SEMIEstimated reading time: 2 minutes
The European Chips Diversity Alliance (ECDA), a European Union-funded initiative coordinated by SEMI Europe, today announced a full-day event on March 27 dedicated to advancing underrepresented groups in the semiconductor industry in collaboration with Learnovate, MIDAS Ireland, and EudaOrg.
Hosted at Dublin City University, Future Proofing Access to Diverse Talent in the Semiconductor Industry will bring together industry leaders, researchers, and professionals to foster meaningful dialogue and actionable strategies for building a more sustainable workforce.
“This event is a crucial bringing together of key stakeholders, to align talent strategies with broader economic and policy goals, ensuring Europe’s semiconductor ecosystem remains globally competitive,” said Laith Altimime, President of SEMI Europe.
As the demand for skilled professionals in microelectronics continues to surge, the challenge of filling open roles persists. A study by ManpowerGroup showed that 77% of employers globally report difficulties in hiring, while 57% of consumers express loyalty to socially responsible companies according to Deloitte. Addressing these issues requires a proactive approach to workforce development that prioritizes inclusion and equitable opportunities for all talent.
The event will feature discussions and presentations from distinguished industry and academic leaders, exploring the latest research on workforce diversity and practical strategies for fostering inclusion. Experts will share real-world case studies on successful workforce development initiatives and engage attendees in interactive sessions designed to equip them with tools for driving meaningful change within their organizations.
“Diversity plays a crucial role in fostering creativity and problem-solving,” said Nessa Maguire, Director at EudaOrg. “Inclusive teams bring varied perspectives, leading to breakthrough technologies and more resilient supply chains.”
This gathering highlights the semiconductor industry’s commitment to not only attracting but also retaining the next generation of talent. Future-Proofing Access to Diverse Talent in the Semiconductor Industry will take place on March 27, 2025, at Dublin City University’s St Patrick’s Campus.
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Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.