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Beyond Design: Inductance—The Silent Architect Driving SI and PI

11/11/2026 | Barry Olney -- Column: Beyond Design
Inductance is the quiet saboteur of high speed design. It doesn’t reveal itself the way impedance discontinuities do, nor does it leave the obvious clues that poor routing or inadequate stackups produce. Yet it shapes nearly every facet of signal integrity (SI) and power integrity (PI), influencing how energy moves, how noise couples, how timing shifts, and how the power distribution network (PDN) responds under dynamic load.

High-Frequency High-Speed CCL Market to Reach $3.1B by 2035

08/13/2026 | Globe Newswire
The global high frequency high speed copper clad laminate market was valued at $4.5 billion in 2025 and is estimated to grow at a CAGR of 10.3% to reach $11.8 billion by 2035.

Vishay Intertechnology TSOP15300 Series IR Receivers Support All Major Remote Control Codes

08/04/2026 | Globe Newswire
Vishay Intertechnology, Inc. introduced a new series of infrared (IR) receiver modules for IR remote control applications.

IEEE Study Demonstrates Full-Wave Simulation of Kerr Frequency Comb Generation

08/03/2026 | PRNewswire
Kerr optical frequency combs are compact light sources used in many applications, including precision measurements to high-speed communications.

Trouble in Your Tank: At 40 GHz, Everything Matters, Part 2

07/27/2026 | Michael Carano -- Column: Trouble in Your Tank
In Part 1 of this article, we examined alternative solderable finishes for 5G/6G applications and reviewed literature on their performance at high frequencies. We found that certain solderable finishes are more susceptible to signal loss as frequency increases. These attenuation losses become increasingly significant at frequencies approaching and exceeding 40 GHz. Because of their high conductivity, silver and copper generally outperform finishes such as nickel and palladium. Taken together, these findings underscore the importance of finish selection in high-frequency applications.
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