Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Bourns Introduces Line Filter Series with Ferrite Toroid Core that Delivers High Impedance Over a Broad Frequency Range

05/30/2025 | Bourns
Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, introduced a new filter series designed with a ferrite toroid core. Bourns specifically engineered its SRF1360 line filters to deliver high impedance over a broad frequency range.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/30/2025 | Andy Shaughnessy, Design007
I don’t have a scorecard, but I do have a weekly wrap-up of must-reads that I think deserve another “bite of the apple,” so to speak. IPC’s Rich Cappetto shares his perspective on everything from tariffs to the CHIPS Act. Columnist Josh Casper discusses the use of AI in 3D AOI systems and the immediate benefits that AI can bring about. Columnist Anaya Vardya explains how technologies like AI can improve our customer service, as well as our manufacturing processes.

High-frequency EMC Noise in DC Circuits

05/29/2025 | Karen Burnham, EMC United
EMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.

Facing the Future: The Role of 5G and Beyond in Shaping PCB Demand

05/13/2025 | Prashant Patel -- Column: Facing the Future
Innovations that push the boundaries of connectivity shape the future of technology, processing power, and miniaturization. 5G and emerging 6G technologies are critical in transforming industries from telecommunications and healthcare to autonomous systems. This affects the printed circuit board (PCB) industry, where demand for high-performance, miniaturized, and advanced PCBs is surging. This column explores the key applications of 5G and beyond, the challenges in designing high-frequency PCBs, the effects of miniaturization, industry collaborations, and opportunities for North American companies in this space.

StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA

05/07/2025 | StratEdge
StratEdge Corporation will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in