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Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1

10/25/2024 | I-Connect007
The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.

Unlock Unmatched Performance for Matched Impedance Devices with StratEdge at IEEE BCICTS 2024

10/22/2024 | StratEdge
StratEdge Corporation, an industry leader in high-frequency and high-power semiconductor packaging, is excited to announce its participation in the IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS).

Würth Elektronik Expands Ferrite Range for Electromobility Applications

10/22/2024 | Wurth Elektronik
With the WE-OEFA-LFS ferrite, Würth Elektronik is releasing an oval-shaped ferrite ring for interference suppression at low frequencies.

TTM Technologies Unveils Xinger® Ultra Wide Band Balun Transformers for Efficient Signal Conversion Across Markets

09/25/2024 | TTM Technologies, Inc.
TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies and printed circuit boards (“PCB”s) is introducing its ultra-compact, low-profile broadband balanced to unbalanced transformers, the XMB0220K1-50100G and XMB0465Z1-50100G.

StratEdge Brings Gold Medal Performance with its Molded Ceramic and Post-fired Ceramic Packages, and High-reliability Assembly Services

08/14/2024 | StratEdge
StratEdge Corporation is redefining the landscape of semiconductor packaging with its cutting-edge molded and post-fired ceramic packages, supported by industry-leading high-reliability assembly services.
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