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Infineon, Stellantis to Advance Innovation in Power Conversion and Distribution for Vehicle Architectures

11/08/2024 | Infineon
Stellantis N.V. and Infineon Technologies AG announced they will work jointly on the power architecture for Stellantis’ electric vehicles to support Stellantis’ ambition of offering clean, safe and affordable mobility to all.

Next Generation of OEM Telematics with Fleet Complete and Mobilisights Data Platform Integration

01/15/2024 | BUSINESS WIRE
Fleet Complete, a global leader in connected fleet management solutions, is pleased to announce the launch of its original equipment manufacturer (OEM) telematics data support for Stellantis connected vehicles, the automaker behind iconic brands like Dodge, Ram, Jeep and Chrysler, through Mobilisights, the Stellantis Data as a Service Company.

SiliconAuto to Design and Sell State-of-the-art Semiconductors for Automotive Industry

06/20/2023 | Foxconn
Stellantis N.V. and Hon Hai Technology Group announced the creation of SiliconAuto, a 50/50 joint venture dedicated to designing and selling a family of state-of-the-art semiconductors to supply the automotive industry, including Stellantis, starting in 2026.

Stellantis, Qualcomm Collaborate to Power New Vehicle Platforms with Snapdragon Digital Chassis Solutions

04/14/2022 | Qualcomm Technologies, Inc.
Stellantis N.V. and Qualcomm Technologies, Inc. announced a multi-year technology collaboration to utilize the latest Snapdragon Digital Chassis advancements to deliver intelligent, customizable and immersive in-vehicle experiences to millions of vehicles across Stellantis’ 14 iconic automotive brands beginning in 2024.

Stellantis, Foxconn Partner to Design, Sell New Flexible Semiconductors for Automotive Industry

12/07/2021 | Foxconn
Stellantis N.V. and Hon Hai Technology Group, (Foxconn) announced the signing of a non-binding memorandum of understanding to create a partnership with the intent to design a family of purpose-built semiconductors to support Stellantis and third-party customers.
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