Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Whole Cloud Market in Asia/Pacific will Hit $329.1B in 2027
July 8, 2024 | IDCEstimated reading time: Less than a minute
According to a recent IDC report, Asia/Pacific Whole Clou d Forecast, 202 4 –202 7, the Asia/Pacific Whole Cloud spending is forecasted to grow at a CAGR of 17.3% and reach $329.1 billion by 2027. Asia/Pacific Whole Cloud spending grew at a year-over-year (YoY) rate of 10% in 2023, and IDC expects the market to grow at 23.4% in 2024 as cloud-related spending continues to accelerate.
"Despite last year’s economic challenges, there has been considerable demand for the cloud as it becomes the foundation for innovation and a key enabler for leveraging AI. We anticipate robust investments across hardware, software, professional, and managed services as organizations (including governments) in the region aim to scale their digital economies. A major focus will also be on cloud cost optimization with the outlook to maximize utilization of cloud resources,” says Shouvik Nag, Senior Research Analyst, Cloud Research, IDC Asia/Pacific.
Since the last decade, cloud technologies have enabled innovation at scale and speed. The last few years have seen a shift towards leveraging cloud as an operating model and delivery platform; it will continue to play a critical but increasingly supporting role in enabling a rapid pivot to the AI everywhere era.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.