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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Ventec’s Value-Added Equipment Division Welcomes Marc Ladle as Project Manager
July 9, 2024 | VentecEstimated reading time: 1 minute
Ventec is pleased to announce the appointment of Marc Ladle to the position of Project Manager for Ventec Giga Solutions, its value-added PCB equipment division. Marc takes on his responsibility to assist customers with PCB manufacturing investment decisions by providing process design advice and technical input for equipment specifications. He will also manage and coordinate installation and commissioning at customer's premises. This latest addition to the Ventec Giga Solutions team demonstrates the company’s commitment to continue to considerably grow its value-added equipment business.
Marc started his professional career in precision engineering, moving into PCB manufacturing quality and production management roles at Eurotech in 1994. After joining APW in 1998 at their Southampton backplane facility, he helped rebuild the facility and replace equipment across the multilayer panel manufacturing line. His next step up the career ladder was his production manager appointment at Lyncolec where he oversaw the production of multilayer flex products amongst others. Since 2004, Marc has been responsible for project managing the installation of a variety of equipment, including AOI, Drilling and Routing, Electric Test, Drop on Demand Printing, Screen Printing, Photo Plotting, Plating lines (including VCP), and a significant number of Horizontal Process lines.
With over 37 years of focused PCB industry experience and an in-depth understanding of manufacturing processes and requirements, Marc brings considerable knowledge of working with suppliers and customers in over 30 countries across 5 continents. His excellent reputation and industry network has been built from consistent high-quality project management and delivery of client projects from specification through to equipment installation and commissioning of single equipment and entire industrial installations.
Ventec Giga Solutions provides comprehensive one-stop shop solutions to PCB and related industry customers globally, including factory design, equipment selection, sales, installation, and commissioning. The extensive equipment and consumables offering from Ventec Giga Solutions partners includes inkjet solutions (Hi-Print), laminator & laser application equipment (Leetech), vacuum filling & screen printing (Sunus), optical layup systems (Surge Robotic), cleaning machines & adhesive products (Yeitek), specialist lamination plates and pads (Cardel) and abrasives & non-woven products (Falkenrich).
"I am pleased to welcome Marc to our expanding equipment division team. His extensive industry knowledge and his specialist expertise for PCB manufacturing processes will further enhance our commitment to providing unrivalled process advice and technical support at the highest level to our growing global customer base”, said Ramesh Dhokia, Business Unit Director.
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BEST Inc. Publishes Optimizing BGA Rework Techniques to Ensure Quality Tech Paper
04/15/2026 | BEST Inc.BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the printed circuit board rework process.
Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense
04/14/2026 | Jesse Vaughan -- Column: Beyond the BoardAs mil/aero electronics push toward higher density, tighter tolerances, and more complex constructions, another trend has unfolded in parallel. It receives far less attention but carries equal consequence: A significant reduction in the number of fabricators that can support complex PCB manufacturing.
IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
BTU Appoints Performance Technologies Group as Exclusive Representative in Tri-State Region
04/08/2026 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced that Performance Technologies Group, Inc. (PTG) has been appointed as its exclusive manufacturers’ representative for New York, New Jersey, and eastern Pennsylvania, effective March 20, 2026.
SEMI Reports Global Semiconductor Equipment Billings Reached $135 Billion in 2025, Up 15% YoY
04/08/2026 | SEMIWorldwide sales of semiconductor manufacturing equipment increased 15% to $135.1 billion in 2025 from $117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported.