-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Altair Releases Altair HyperWorks 2024
July 10, 2024 | AltairEstimated reading time: 3 minutes

Altair, a global leader in computational intelligence, announced the release of Altair® HyperWorks 2024, the market’s leading platform for design and simulation. The latest release delivers significant advancements in artificial intelligence (AI)-powered engineering and business, mechanical and electronics systems design, and simulation-driven design and optimization.
“Altair HyperWorks 2024 is the only platform offering a unified, modern user experience across any geometry, physics, and complexity and at every stage of the product development life cycle from design to in-service,” said James R. Scapa, founder and chief executive officer, Altair. “With AI-embedded workflows, game-changing photorealistic graphics, and a unified back-end data system, Altair HyperWorks is the foundation upon which many of the world’s most innovative digital engineering practices are being built.”
AI-Powered Engineering and Business
Providing the data backbone essential for AI enterprises, Altair HyperWorks 2024 unleashes AI across every step of the product life cycle. Seamlessly embedded AI in design and simulation tools accelerates exploration, while engineer-friendly, HPC-fueled workflows augment the human-AI relationship. Altair HyperWorks 2024 deepens these capabilities, enhancing processes from design to in-service operations, giving users the ability to:
Accelerate design exploration and iteration with generative design capabilities in Altair® HyperMesh®.
Conduct effortless thermal analysis in Altair® SimLab® through 'what-if' studies using real-world data from Altair® physicsAI™ models to make design of experiments (DOE) more efficient.
Rapidly predict behavior with generative design in Altair® Inspire™ to maximize efficiency in both design and manufacturing while ensuring top performance.
Focus more on innovation, benefiting from dramatically faster training times and enhanced AI-powered capabilities. Engineers can train physicsAI models with a single click on Altair Drive utilizing the scalable HPC and cloud resources of Altair One®. This eliminates infrastructure barriers and accelerates design exploration with advances in AI accessibility.
Leading the Engineering User Experience
Altair HyperWorks 2024 brings forth a paradigm shift in engineering. Through an AI-powered, modern experience, productivity is enhanced by intuitive workflows, efficient design environments, game-changing photorealistic graphics for better visualization, and a unified back-end data model. With support for Python and C++, Altair HyperWorks ensures seamless integration with more than 250 CAD systems, solvers, and file formats, removing interoperability bottlenecks while empowering engineers with extensive scripting capabilities to customize the platform and automate repetitive tasks.
One Source of Truth: Digital Engineering
Altair integrates digital twins and digital threads to create a digital engineering ecosystem, providing one source of truth that ensures engineers have access to the most accurate real-time data and models. The latest updates to Altair® Twin Activate® enhance models’ accuracy and clarity and include customization and integration improvements that expedite the transition from concept to reality.
Additionally, Altair® Material Data Center™ augments the design process by offering more than 72,000 high-fidelity, CAE-ready material datasets, empowering alternative material exploration throughout the product development life cycle with one traceable digital thread.
Mechanical and Electronic System Design
Altair HyperWorks 2024 focuses on elevating design fidelity and streamlining engineering workflows with robust integration and automation capabilities. It includes:
- Enhanced productivity with Python API in HyperMesh, empowering engineers to automate routine tasks, tailor their CAE environment with custom plugins, integrate with other tools, and access a vast support network through the Python community.
- Accelerated electronics system design perfection from the start with SimLab. Through the Ultra Librarian integration, users get faster, more accurate 3D printed circuit board (PCB) modeling. Users can predict and enhance PCB lifespan with fatigue life simulations, analyze electric motors using advanced multiphysics analysis, and simulate diverse materials to understand fluid flow dynamics.
- Meshless ECAD simulation with Altair SimSolid®, transforming mechanical and electronics systems into smart, connected realities, from requirements to embedded systems, with new solver capabilities for multi-disciplinary electronics. It empowers users to seamlessly transition from ECAD to simulation, optimizing the analysis of complex PCB and integrated circuit (IC) models without the need for traditional meshing or design simplifications.
Simulation-Driven Design and Optimization
As the most comprehensive simulation-driven design solution for design, performance analysis, and manufacturability, Inspire reinforces its market-leading position. Starting with a sketch, users can build or edit geometries with parametric B-Rep solids, polyNURBS, facets, and implicit modeling. It features analysis tools for structural, fluid dynamics, and motion studies, complemented by designer-friendly computational physics for detailed analysis across various manufacturing processes. Inspire also integrates powerful technologies like generative design, meshless simulation, and physicsAI for rapid behavior prediction, maximizing design and manufacturing efficiency while ensuring top performance.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.