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Mouser Electronics Examines the Human-Centric Revolution of Industry 5.0

12/04/2024 | PRNewswire
Mouser Electronics, Inc., the global authorized distributor renowned for providing the latest in electronic components and industrial automation solutions, today unveiled the newest chapter in its Empowering Innovation Together (EIT) technology series, which focuses on the emerging landscape of Industry 5.0. In this next phase of industrialization, human, environmental, and social considerations will factor into the advanced technology, robotics, and smart machines on the factory floor of the future.

Meeting in Vienna: PCB Designers Invited to Engage in the Silicon to Systems Process

11/08/2024 | Michelle Te, IPC Community
PCB designers interested in innovative ideas, technical prowess, relevance, quality, and doing their best work can now register for the inaugural Pan-European Electronics Design Conference (PEDC), Jan. 29-30, 2025, in Vienna, Austria.

High Density Packaging User Group Announces Dynamic Electronics Membership

10/14/2024 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.

Site Consolidation at Würth Elektronik

10/09/2024 | Wurth Elektronik
Würth Elektronik Circuit Board Technology, printed circuit board manufacturer headquartered in Niedernhall, Baden-Württemberg, announced at the company meeting the planned closure of its PCB production in Schopfheim.

Department of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production

10/01/2024 | Department of Defense
The Department of Defense announced today a $30 million award to TTM Technologies Inc. (TTM) in Santa Ana, California. This award, facilitated through the Defense Production Act Purchases (DPAP) office, will enable TTM to acquire and install advanced manufacturing equipment and develop prototype designs for printed circuit boards. The project will commence at TTM's Centers of Excellence across the United States, ultimately culminating in integration into its new Syracuse, New York facility. This strategic initiative aims to enhance TTM's capabilities and enable the timely delivery of cutting-edge technology to support vital defense programs.
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