-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
TRI at SMTA Chihuahua Expo & Tech Forum 2024
July 15, 2024 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is excited to announce its participation in the SMTA Chihuahua Expo & Tech Forum 2024, held at the Sheraton Chihuahua Soberano scheduled to take place on August 15, 2024.
Visit TRI's stand to discuss how TRI's One Stop Solution for PCB Assembly Testing and Inspection is reshaping the SMT Industry. TRI's product line includes Optical Inspection (SPI, AOI, and AXI) and Board testing (ICT and MDA).
TRI's AXI solutions, TR7600 Series, offer fast image reconstruction and full-coverage defect detection capabilities. These innovative features, combined with a broad range of specifications, including High Multi-Resolution 2 - 30 µm, AI-powered inspection algorithms, adjustable imaging parameters, and inline fine-tuning capabilities, make the TR7600 Series a compelling choice. Unlike competitors, TRI's X-ray inspection solutions secure the sample on the conveyor while inspecting it, preventing further damage.
The TR7600 Series satisfies the inspection needs of the electronics manufacturing industries such as Advanced Packaging, Automotive, Aerospace, Telecommunications, and Medical. The AXI series is also capable of inspecting large boards of up to 2100 x 510 mm. The 3D CT AXI equipment ensures meticulous inspection across various components, including BGA, QFN, SiP, PTH, PoP, C4 Bumps, and more.
The TRI solutions facilitate data exchange between the production line and the MES system of your choice, enabling data traceability for the connected factory. TRI's solutions are compliant with Industry 4.0 standards, such as IPC-Hermes-9852, IPC-DPMX, and Connected Factory Exchange (IPC-CFX).
Visit TRI's stand at the SMTA Chihuahua & Tech Forum 2024 to discover why the leading EMS companies choose TRI as their Test and Inspection Partner.
Suggested Items
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.
Koh Young Showcases Inspection Innovations at IPC APEX EXPO 2025 in Anaheim, California during March 18-20, 2025
03/10/2025 | Koh YoungKoh Young, the global leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for an in-depth look at its cutting-edge inspection technologies. Taking place at the Anaheim Convention Center from March 18–20, 2025, this year’s event highlights Koh Young’s continued advancements in AI-powered process optimization and quality assurance.
TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
03/04/2025 | ACCESSWIRETASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.
Incap’s Estonian Factory Invests in Innovative X-ray Technology
03/04/2025 | IncapThe electronics manufacturing company Incap Estonia, based in Saaremaa, has enhanced its quality control capabilities with a new high-resolution X-ray system.
Koh Young America Expands Sales Network with Electronic Assembly Products for Colorado and Utah
03/04/2025 | Koh Young AmericaKoh Young America, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce the addition of Electronic Assembly Products, Inc. (EAP) as its sales representative for Colorado and Utah, effective March 3, 2025.