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DesignCon 2025: Stacking the Professional Deck

02/05/2025 | Marcy LaRont, I-Connect007
After two full days of technical presentations, networking, and visiting with exhibitors on the show floor, the final day at DesignCon featured an exciting lineup of sessions and discussions, culminating in a wealth of knowledge for electronics professionals and included a thought-provoking keynote on global connectivity through low-earth orbit satellites presented by Amazon's Nima Mahanfar. Additionally, the Women in Engineering reception provided valuable insights on work-life balance and personal growth in the industry.

Optical Transceiver Shipments Projected to Grow by 56.5% in 2025

02/05/2025 | TrendForce
While DeepSeek has successfully reduced AI training costs, the broader cost reduction of AI models is expected to expand application scenarios and drive an increase in global data center deployments.

Keysight, KD Partner to Advance Multigigabit Optical Automotive Ethernet Testing with New Signal Analysis Capability

01/30/2025 | Keysight Technologies
Keysight Technologies, Inc. and KD, Inc., a fabless semiconductor company, have collaborated to create a comprehensive test for Multigigabit Optical Automotive Ethernet physical layer.

Beyond Design: Electro-optical Circuit Boards

01/22/2025 | Barry Olney -- Column: Beyond Design
Predicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.

Global PCB Connections: The Future of HDI PCBs

01/16/2025 | Jerome Larez -- Column: Global PCB Connections
High-density interconnect (HDI) printed circuit boards (PCBs) transform modern electronics by providing increased functionality, reduced sizes, and enhanced performance in complex designs. They do so by using advanced techniques, such as finer line and space definitions, microvias, and additional board layers. Specialized via structures—namely blind, buried, and stacked vias—offer complex routing while conserving space. This allows for the development of highly compact electronic devices. This article delves into HDI PCB technology, the function and benefits of blind, buried, and stacked vias, and their impact on PCB performance and design.
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