Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
Electronic System Design Industry Posts $4.5 Billion in Revenue in Q1 2024
July 16, 2024 | SEMIEstimated reading time: 1 minute
Electronic System Design (ESD) industry revenue increased 14.4% to $4,521.6 million in the first quarter of 2024 from the $3,951.1 million registered in the first quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 14.8%.
“The electronic design automation (EDA) industry continued to report strong revenue growth in Q1 2024,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “All product categories reported increases, with CAE, IC Physical, Semiconductor IP and Services posting double-digit upticks. Further, all geographic regions reported growth, with the Americas and Asia Pacific logging double-digit revenue gains.”
The companies tracked in the EDMD report employed 61,653 people globally in Q1 2024, a 6.9% jump over the Q1 2023 headcount of 57,696 and up 2.6% compared to Q4 2023.
The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.
Revenue by Product and Application Category – Year-Over-Year Change
- Computer-Aided Engineering (CAE) revenue increased 13% to $1,621.1 million. The four-quarter CAE moving average increased 18.9%.
- IC Physical Design and Verification revenue grew 13.9% to $769.6 million. The four-quarter moving average for the category increased 17.5%.
- Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 2.8% to $378.9 million. The four-quarter moving average for PCB and MCM rose 13.2%.
- Semiconductor Intellectual Property (SIP) revenue increased 18.6% to $1,578.1 million. The four-quarter SIP moving average rose 10.3%.
- Services revenue jumped 22.3% to $173.9 million. The four-quarter Services moving average rose 12.3%.
Revenue by Region – Year-Over-Year Change
- The Americas, the largest reporting region by revenue, procured $1,937.2 million of electronic system design products and services in Q1 2024, a 14.1% increase. The four-quarter moving average for the Americas rose 12.1%.
- Europe, Middle East, and Africa (EMEA) procured $579.0 million of electronic system design products and services in Q1 2024, a 9.2% increase. The four-quarter moving average for EMEA grew 14.6%.
- Japan’s procurement of electronic system design products and services grew 2.8% to $280.7 million. The four-quarter moving average for Japan increased 8.9%.
- Asia Pacific (APAC) procured $1,724.7 million of electronic system design products and services in Q1 2024, a 19% increase. The four-quarter moving average for APAC grew 19.2%.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.