-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Sustainability and Workforce Topics Dominate Day 2 of SEMICON West
July 16, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 8 minutes
Sustainability and the workforce were prolific themes for the second day of SEMICON West on July 10. Sustainability kicked off with keynote speaker Al Gore, the former U.S. vice president and arguably America’s most passionate environmental advocate for nearly 50 years. He once again outlined the serious environmental issues and timelines we are facing and emphasized the importance of the industry’s commitment to sustainability initiatives.
He was followed by Jeff Thomas of Nasdaq, who began by asking, “Did you know that Nasdaq is a technology company?” I did not. Additionally, Nasdaq is a partner of SEMI in the area of sustainability, having co-created a white paper titled “The Rising Tide: Building a Climate-Resilient Semiconductor Value Chain.” He also described Nasdaq’s recently created an Environmental Sustainability Goals (ESG) Advisory Service, where it has leveraged AI to aggregate and organize massive amounts of sustainability data so companies can use it to meaningfully benchmark their ESG progress. He concluded by stating that we all have a role in sustainability and emphasized that semiconductors are poised to do such important work, but innovation must be undertaken responsibly and with an eye toward sustainability.
Next up was a CEO panel discussion featuring Frank Sanders, corporate vice president of Intel, Angela Baker, corporate sustainability officer at Qualcomm, and John Powers, vice president at Schneider Electric, and moderated by SEMI’s Mousumi Bhat. They were asked about collaboration, undertaking risk assessments, and how their companies are addressing the seemingly unquenchable thirst for the power of modern-day devices in their own product development. Frank Sanders spoke about Intel’s RISE program: responsible, inclusive, sustainable, enable. He explained that keeping themselves accountable to their ESG commitments is part of Intel’s culture to the degree that some amount of compensation across the entire company is tied to it. He also stated strongly that they cannot solve these problems alone and have created a consortium of stakeholders that includes government and academia.
“We talk about everything from how we measure to how we create action plans to how we have accountability,” he said. He touched upon the changing regulatory landscape, using a memorable turn of phrase, maintaining “the ongoing right to operate.” Schneider has also recently become a partner to Intel’s Catalyze program, focused on looking at all emissions and environmental impact upstream and downstream of the supply chain to assess total environmental impact and real progress.
Regarding risk assessment, Intel uses a risk registry approach and does scenario planning exercises. When asked if the industry was ready or if we even had the tools to address these huge, global environmental challenges, Angela Baker commented that doing so must be a cross-functional endeavor. She proclaimed the need to bring in other industries entirely, like agriculture, which also has significant carbon footprints being addressed. John Powers of Schneider stated emphatically that we have the technology to relatively easily and inexpensively achieve the first 60+% of zero waste goals, but it will take both government and corporate will to make it happen; these are things he is not convinced we have. Baker agreed, saying that we must achieve some of these things much faster than we are currently on pace to do. Her comment contained the unspoken opinion that it simply will not happen unless and until companies are legally compelled to.
AI is driving a thirst for energy, potentially overwhelming our existing energy grids. Bhat presented a slide showing a 24% per year growth in the need for energy against a backdrop of a 3% growth rate in renewable energy sources. She stated that the two would not intersect until 2040 and said that even if we could create all the renewable energy we would need, our energy grids couldn’t handle it. Qualcomm mentioned its work in “On-Device AI” where some amount of AI and the data needed to use it will be on the device itself, not in the cloud. The others echoed similar sentiments around approaching product development in ways that would relieve the grid.
The dramatic need for data processing and storage capabilities made for a nice segue into a presentation on quantum computing by Subodh Kulkarni of Rigetti, in a presentation titled “Building on Decades of Semiconductor Innovation for Transformative Computing Power.”
“We're on a mission to build the world’s most powerful computers to help solve humanity’s most important and pressing problems,” he said, which sounded more like a directive than a mission. He echoed a common theme by emphasizing the necessity of collaboration, and heralded Rigetti’s open-source forum for collaboration as opposed to more closed systems used by other companies. He also took us through a brief comparison of high-level computing models and compared Qbit's amazing and powerful ability to stay entangled—no matter how far apart they may be—to photonics technology, which is inherently challenged by the fact that photons do not like to entangle with one another. He touted hybrid computing as a mid-term solution to going full quantum, in which Rigetti is deeply involved. Kulkarni concluded his presentation by providing some price points for those interested. If you are ready to embrace quantum computing, you can be set up with a 9 Qbit system for just under $1 million and a 24 Qbit system for between $5-6 million, emphatically proclaiming, “Quantum computing is happening in the new few years. It is only a question of ‘when,’ not ‘if.’”
Page 1 of 2
Suggested Items
UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2
12/23/2024 | Anaya Vardya, American Standard CircuitsUltra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/20/2024 | Nolan Johnson, I-Connect007Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Offshore Sourcing in the Global Supply Chain
11/20/2024 | Brittany Martin, I-Connect007Bob Duke, president of the Global Sourcing Division at American Standard Circuits, discusses the challenges and benefits of navigating the global supply chain, including the value of strong supplier relationships, rigorous quality control, and strategic sourcing from regions including China, Vietnam, and India.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.