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Indium Corporation Introduces Au-Based Precision Die-Attach Preforms
July 17, 2024 | Indium CorporationEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/3817/2122/3597/PDAPreforms.jpg)
Indium Corporation® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of precision to reduce defects, control bondline thickness (BLT), and deliver high-yield performance and reliability in critical die-attach applications.
Semiconductor laser die-attach applications require the highest quality, ultra-precise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed, highly reliable end product. Indium Corporation’s Au-based PDA Preforms offer the new gold standard. Features include:
- Highly accurate thickness control
- Precise edge quality
- Optimized cleanliness
- Default waffle pack method
- Available for gold-based alloys
“We are excited to offer our gold-based PDA preforms because they are able to uniquely meet our customers’ needs for highly automated, precision processes,” said Indium Corporation Senior Product Manager Jeff Anweiler. “They not only reduce solder-related defects and die-tilt, but they also increase process yield performance. These products deliver superior thermal transfer, operational efficiency, and device reliability, especially for critical laser and RF applications, as well as 5G communications.”
Indium Corporation’s Au-based PDA Preforms are available in the following alloys:
- Primary alloys:
- 80Au/20Sn
- 79Au/21Sn
- Development alloys:
- 78Au/22Sn; 77Au/23Sn; 76Au/24Sn; 75Au/25Sn
- 88Au/12Ge
- 96.8Au/3.2Si
- 82Au/18In
Selecting the right preform characteristics and packaging is crucial for consistent success in production processes. Every application has unique parameters, making it essential to design a preform and its packaging to meet these specific needs.
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Indium to Feature Precision Gold-Based Die-Attach Preforms at International Microwave Symposium
06/05/2024 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach (PDA) preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, Washington, D.C., June 18-20.
TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE Preforms
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01/12/2024 | Indium CorporationIndium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at SPIE Photonics West, Jan. 27-Feb. 1, in San Francisco.
Indium Corporation Earns IEEE Outstanding Industry Award for Innovative Solder Preforms
07/06/2023 | Indium CorporationIndium Corporation has earned the IEEE Malaysia Section Outstanding Industry Award (Innovation) for its InFORMS® brand of reinforced solder preforms. The award was presented during a ceremony on June 24 in Kuala Lumpur, Malaysia.
Indium Corporation to Present at International Microwave Symposium
04/29/2022 | Indium CorporationOne of the most highly demanded applications for 80Au/20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products.