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Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
A new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.
In this article, we explore the challenges, solutions, and impact on assembly with large BGA devices and propose a new technique appropriate for many electronics segments, including military, aerospace, computing, and communication.
The Need for BGA Re-balling
There are several reasons for BGA re-balling, including economic, technological, reliability, sustainability, and specific industry requirements.
To read this entire article, which appeared in the July 2024 issue of SMT007 Magazine, click here.
