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Zhen Ding Highlights AI PCBs, IC Substrates at TPCA 2025

10/22/2025 | Zhen Ding
The annual PCB industry event, TPCA Show 2025, kicked off on October 22 at the Nangang Exhibition Center. Zhen Ding Tech Group showcased a full range of high-end PCBs and IC substrates under the theme of artificial intelligence (AI).

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/17/2025 | Marcy LaRont, I-Connect007
Much of the news over the last week focused on the push-pull between the U.S. and China and the latter’s most recent announcement about rare earth mineral restrictions. Despite that situation, the IMF raised its growth forecast, and global markets showed cautious optimism. Then, as the U.S. attempted to retreat from all environmentally based policy and ESG gains achieved to date, the global shipping emissions pact continues to gain momentum.

SCHMID Group Expands Advanced Packaging Portfolio to Power the AI Era

10/14/2025 | EINPresswire.com
SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI).

Is Glass Finally Coming of Age?

10/13/2025 | Nolan Johnson, I-Connect007
Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.

SCHMID Advances Next-Gen Advanced Packaging with New InfinityLine and Glass Core Substrate Solutions

09/29/2025 | SCHMID Group
SCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI).
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