Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Powering the Future: Why Engineers Are Switching to Ceramic Substrates

11/12/2026 | Brian Buyea -- Column: Powering the Future
Walk into any design review, whether it’s for an EV inverter, a radar system, or a high-frequency amplifier, and you’ll hear the same concern repeated in different ways: “How are we managing the heat?” That question, more than anything else, is driving one of the most important material shifts happening in electronics today. Engineers are moving deliberately and increasingly toward ceramic substrates. Not because they’re trendy, but because they solve problems that traditional materials simply can’t solve anymore.

SCHMID Wins Wet-Process Equipment Order for South Asia’s First Glass Core Facility

11/09/2026 | SCHMID Group
Order marks an important step on the industry’s path from pilot lines to volume manufacturing of glass core substrates for AI and high-performance computing.

Global Electronics Association Hosts IMPACT 2026 Session on Advanced Electronic Packaging System Integration, with Technical Perspectives from Unimicron, STATS ChipPAC and Wistron

10/22/2026 | Global Electronics Association
The Global Electronics Association hosted the session "Advancements in Component to System Integration" at IMPACT 2026, bringing together Unimicron, STATS ChipPAC, Wistron and market research firm TechSearch International.

Samsung Electro-Mechanics Signs KRW 360.5 Billion Package Substrate Supply Deal

10/21/2026 | Samsung Electro-Mechanics
Samsung Electro-Mechanics has signed a long-term supply agreement (LTA) worth KRW 360.5 billion for 'Memory Semiconductor Package Substrates' with a global major corporation.

Follow the Story: Building the Hardware Behind AI

09/24/2026 | Michelle Te, I-Connect007
When TTM opened its new UHDI facility in New York earlier this year, it wasn't simply adding another PCB factory. As the largest circuit board builder in the United States, TTM was investing in technologies that bring PCB fabrication closer to the complex world of semiconductor packaging. The advent of AI helps explain why that matters. The enormous compute power required by AI is pushing chip performance to new levels, but those chips don't operate in isolation.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in