Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
Fresh PCB Concepts: PCB Stackup Strategies—Minimizing Crosstalk and EMI for Signal Integrity
Connect the Dots: Designing for Reality—Solder Mask and Legend
Strip Etch Strip: Episode 9 of On the Line With... Designing for Reality Podcast Now Available
July 25, 2024 | I-Connect007Estimated reading time: Less than a minute
Don't miss the latest episode of "On the Line With... Designing for Reality," where we walk through the PCB manufacturing process. At this stage, we have a panel made up of all the internal layers laminated together, through-holes drilled, and the outer layer copper features covered with a protective layer of tin. Join us as ASC Sunstone’s VP Matt Stevenson guides us through the process sequence for outer layer strip, etch, and strip.
This series offers specific insights that can impact circuit board manufacturing, providing tips and tricks for optimizing design, fabrication, yields, and cost.
I-Connect007 is committed to delivering digital content that meets the needs of the electronics industry, including magazines, books, newsletters, market reports, podcasts, and event coverage. As the industry's longest-running digital media company, I-Connect007 is a leading publisher of original content for the global electronics industry.
Visit our educational resource center to access more free content.
Share on:
Suggested Items
The Chemical Connection: Can Changing Spray Nozzles Improve My Etch Quality?
01/13/2025 | Don Ball -- Column: The Chemical ConnectionWhenever the need to improve etch quality due to tightening customer specifications arises, the inevitable question asked early on is, “Will going to a different type of nozzle or nozzle flow rate make my etch quality better?” Unfortunately, the answer is most likely, “Probably not.” (Sorry, folks.) So, why not?
Data Paints a Picture—Can You See It?
01/09/2025 | Marcy LaRont, PCB007 MagazineAndrew Kelley is CTO of Xact PCB, a company founded by engineers with firsthand experience in PCB fabricators. Xact PCB has developed a cutting-edge system to monitor and predict the registration of inner layers through advanced registration control systems. By leveraging data collected from various production stages, Xact PCB’s GX tool enhances precision. It minimizes errors, ensuring that the final products meet their customers' exact specifications while eliminating the need for costly pilot lots.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
Fresh PCB Concepts: PCB Stackup Strategies—Minimizing Crosstalk and EMI for Signal Integrity
01/09/2025 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are critical components in almost every modern electronic device, but their design goes far beyond routing signals from one point to another. The stackup of a PCB (the arrangement of its layers) has a significant impact on signal integrity, electromagnetic interference (EMI), and crosstalk. The complexity of these issues grows exponentially as designs increase in speed, frequency, and complexity.
Revolutionizing Inner Layer Registration
12/26/2024 | Marcy LaRont, I-Connect007In this interview with Anthony (Tony) Faraci, founder and president of DIS, we delve into enhancing inner layer accuracy and yields, pivotal to boosting profitability in the circuit board industry. Tony has extensive experience in the development of tooling technology over the decades, which ultimately led to his founding DIS. From his beginnings at Multiline to tackling the challenges of registration accuracy, Tony's insights clearly lay out the complexities of modern manufacturing and the innovations in shaping the future of inner layer registration.