-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Winners of the IPC Hand Soldering and Rework Competition Malaysia at Electronics Manufacturing Expo Asia (EMAX) 2024 Announced
July 29, 2024 | IPCEstimated reading time: 1 minute
In conjunction with Electronics Manufacturing Expo Asia (EMAX) 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Penang, Malaysia July 24-26, 2024. The competition welcomed 36 contestants from 14 well-known electronics companies, and one institution in Malaysia.
Skilled contestants competed against each other to rework a functional electronics assembly within a 50-minute time limit. Assemblies were judged on soldering in accordance with IPC-A-610H, IPC J-STD-001H, IPC-7711/21C - Class 3 criteria, the speed at which the assembly was produced, and overall electrical functionality of the assembly.
On the winner’s podium at EMAX 2024 were:
- First Place: Pubalan Sivasangkar, Cytron Technologies Sdn Bhd. As the winner, Sivasangkar qualified for the IPC Hand Soldering World Championship in Germany in November 2024.
- The top two runners-up came from the same company, Jabil Circuit Sdn Bhd. Second place this year went to Hasrol Mizam Bin Hassan. Norishah Binti Othman took third place.
IPC would like to thank Hand Soldering and Rework Competition sponsors and partners for their generous support this year.
- Premier Sponsor: JBC
- Gold Sponsor: SOLDERINDO
- Supporting Sponsor: BTE
- Co-Organizer: NRG Exhibitions
For more information on upcoming hand soldering and rework competitions, contact Henry Ton, senior business development manager, Southeast Asia, at HenryTon@ipc.org.
Suggested Items
SMTA UMW Chapter Kicks Off 2025 with 'Manufacturing by Design is the New DFM' Technical Session
01/06/2025 | SMTAThe Upper Midwest Chapter (UMW) of the Surface Mount Technology Association (SMTA) is excited to announce its first technical session of 2025, featuring industry expert Dale Lee presenting "Manufacturing by Design is the New DFM."
HaiLa Technologies Releases Extreme Low-Power Development Platform for Wi-Fi Communications
01/06/2025 | BUSINESS WIREHaiLa Technologies, a supplier of advanced low power wireless semiconductor solutions, introduced a new development platform to better support developers and researchers in creating extremely low power connected solutions.
L3Harris Completes Sale of Specialized Materials Business to BWXT for Approx $100M
01/06/2025 | L3Harris TechnologiesL3Harris Technologies has completed the sale of its specialized materials business, Aerojet Ordnance Tennessee, Inc. (A.O.T.), to BWX Technologies, Inc. for approximately $100 million.
AI Server Market Will Keep Growing Through 2025, with Related Industry Value Projected to Reach $298B
01/06/2025 | TrendForceAccording to the latest research from TrendForce, the value of the entire server industry is estimated to total US$306 billion in 2024.
Nolan’s Notes: Emerging Trends in 2025
01/06/2025 | Nolan Johnson -- Column: Nolan's NotesJanuary is a traditional time to mark changes in our lives. A new year can signal new beginnings. But change is constant. So, as we flip over the calendar into 2025, we look at what’s ahead for the EMS supplier industry. What are your concerns and challenges? What trends are emerging? What can you expect from a new administration?