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Ynvisible Expands Market Reach in Asia through Strategic Distribution Agreement with Taiwan’s HST
July 30, 2024 | Ynvisible Interactive Inc.Estimated reading time: 1 minute
Ynvisible Interactive Inc., a leading provider of printed e-paper display products, is pleased to announce that it signed a new distribution agreement with Hardware & Software Technology Co., Ltd. (HST), a leading technology provider in the Greater China region. Through this partnership, Ynvisible expands its presence in China, Taiwan, Hong Kong and Macau, making its thin, low-power, cost-effective e-paper display products available to interested customers in the region. The non-exclusive distribution agreement with HST aims to expand Ynvisible’s international presence and connect with new customers interested in implementing or developing e-paper based solutions. HST’s in-depth market knowledge and established local network are expected to be valuable in achieving these objectives.
“I’m very excited to work together with Ynvisible to promote their e-paper displays on the Greater China market. We can see a considerable potential for Ynvisible’s displays and the interest among our customers and contacts for this new, low priced and energy efficient solution is fantastic.”- said Johnson Chen, General Manager of HST.
Established in 1993, HST is a leading provider of technologies for low-power wireless communication and biometric verification, and offers complete "Bluetooth Low Energy" & "Fingerprint Identification" design and solutions. The partnership between the two companies is expected to not only expand Ynvisible’s market presence in Asia, but also foster joint development initiatives to potentially integrate Ynvisible’s low-power e-paper displays with Bluetooth Low Energy technology.
“We are looking forward to working with HST, a partner that aligns with our vision on the role e-paper can play in the IoT domain. We believe HST has strong knowledge of the local market needs, understands the competitive benefits of our technology, and has strategic connections within the local ecosystems.“ - said Ramin Heydarpour, CEO of Ynvisible.
Ynvisible aims to become a trusted partner for Asian customers interested in adopting a sustainable, thin, flexible, low power and cost-effective approach to digital displays. The agreement with HST creates a second strategic distribution partnership for Ynvisible in the region. This new alliance complements Ynvisible’s existing partnership with Ynvitech, further enhancing the Company’s presence and distribution network in the area. Ynvisible is ready to supply, through HST and Ynvitech, customers in a wide range of industries, including retail, medical and pharma, supply chain and logistics, industrial, and more.
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BTU International to Feature Aurora Reflow Technology at SMTA Michigan and Ohio Expos
08/15/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the upcoming SMTA Michigan Expo & Tech Forum on Tuesday, August 19 in Livonia, MI, and the SMTA Ohio Expo & Tech Forum on Thursday, August 21 in Independence, OH.
Kopin Announces $9 Million Follow-On Contract for Defense Thermal Imaging Assembly
08/14/2025 | BUSINESS WIREKopin Corporation, a leading provider of application-specific optical systems and high-performance microdisplays for defense, training, industrial, consumer and medical products, today announced the award of an approximate $9 million follow-on production contract in support of a custom thermal imaging assembly build for a major U.S. defense prime contractor.
Materials and Manufacturing for the AI Era: The Next PCB Frontier
08/08/2025 | Edy Yu, Chief Editor, ECIO, and the I-Connect007 Editorial TeamAI is pushing hardware to its limits, and the bottleneck isn’t design anymore—it’s materials. Next-generation AI servers aren’t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T Ethernet systems. Many server motherboards are already 32–36 layers. For the next wave of 1.6T-capable boards, expect 40–50 layers, which must maintain high-frequency performance without degrading signal quality.
iDEAL Signs Technology Partner Agreement for SuperQ MOSFETs with Power System Specialist Richardson Electronics, Ltd.
08/01/2025 | PR NewswireiDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.