Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Altair Signs Collaboration Agreement with the Faculty of Data and Decisions Science at the Technion – Israel Institute of Technology

09/03/2024 | Altair
Altair, a global leader in computational intelligence, announced a collaboration with the Faculty of Data and Decisions Science at the Technion – Israel Institute of Technology. T

Peter Wennink Appointed Member of the Supervisory Board of VDL Groep

09/03/2024 | VDL Groep
Peter Wennink has joined the Supervisory Board of VDL Groep. On 1 September 2024, the 67-year-old former CEO of chip machine maker ASML joined the Supervisory Board of the industrial family business with its headquarters in Eindhoven.

Cadence Launches Fem.AI, Pledges $20M to Kickstart Gender Equity in the AI Workforce

08/23/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced the launch of Fem.AI—an initiative to propel women and the industry towards a more equitable tech sector, with an emphasis on opportunities in AI.

The Rehm Academy Programme is Expanding

08/15/2024 | Rehm Thermal Systems
The Rehm Academy programme includes various training opportunities on the technological background of the systems and their application. In order to be able to continuously expand the portfolio and to counteract long waiting times due to the high demand, Rehm Thermal Systems has decided to move the Academy to a larger adjoining building with more modern equipment at its headquarters in Blaubeuren. New software training courses can be offered as early as September 2024.

Keys to Successful ECAD-MCAD Collaboration

08/08/2024 | Stephen V. Chavez, Siemens EDA
As PCB designs grow in scope and complexity, collaboration between the electronics and mechanical domains is a necessity. At the same time, smaller IC packages and more tightly packed PCBs compel electronics system development companies to think more about the mechanical form factor of items and recognize the importance of collaboration between MCAD and ECAD.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in