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Cadence Unveils Maestro AI Model Portfolio to Advance Agentic Chip and System Design

10/26/2026 | Cadence Design Systems
Cadence announced the Maestro™ AI Model Portfolio, which powers Cadence® AI Super Agents across semiconductor and system design workflows.

Cadence InnoStack AI Agent Supports Socionext’s 3nm SoC Design

10/21/2026 | Cadence Design Systems
 Socionext Inc., a global leader in custom SoC design and development, is actively advancing its SoC design and development capabilities through agentic AI and expanding the application of AI-driven design to the physical design of large-scale system-on-chip (SoCs) using advanced process technologies.

Cadence Wins Five 2026 TSMC OIP Partner of the Year Awards

10/15/2026 | Cadence Design Systems, Inc.
Cadence has been named the 2026 TSMC Open Innovation Platform® (OIP) Partner of the Year, receiving five awards recognizing its collaboration with TSMC across technologies that are shaping AI-era semiconductor design.

Cadence, TSMC Collaborate on Certified Tools and Silicon-Proven UALink IP

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Cadence announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers.

Real Time with... THECA 2026: MKS Academy: Future of PCB Training

09/08/2026 | Real Time with... THECA
Daniel Schmidt, director of marketing and training for MKS' Atotech, officially announced the MKS Academy at this year's THECA event. In the works for the last few years, this new academy presents an innovative e-learning platform designed to address global workforce challenges in advanced PCB manufacturing, and to do so in ways that are most effective for today's learners, as well as in a format that facilitates large-scale learning. Coming at a time when the worldwide workforce gap in electronics and manufacturing is growing to critical proportions, this initiative is crucial for adapting to market shifts and fostering talent development worldwide.
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