Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Cadence Expands Digital Twin Platform Library with NVIDIA DGX SuperPOD Model

09/11/2025 | Cadence Design Systems
Cadence announced a significant expansion of its Cadence® Reality™ Digital Twin Platform library with a digital twin of NVIDIA DGX SuperPOD with DGX GB200 systems.

Cadence to Acquire Hexagon’s Design & Engineering Business

09/08/2025 | Cadence Design Systems
Cadence announced it has entered into a definitive agreement to acquire the Design & Engineering (D&E) business of Hexagon AB, which includes its MSC Software business—a pioneer in engineering simulation and analysis solutions.

Rehm Academy Expands Its Training Program

08/28/2025 | Rehm Thermal Systems
The demands on modern industrial companies and employees continue to rise, and therefore, the topic of further education is becoming increasingly important today.

Cadence Completes Acquisition of Arm Artisan Foundation IP Business

08/28/2025 | Cadence Design Systems
Cadence announced that it has completed the previously announced acquisition of the Arm Artisan foundation IP business, consisting of standard cell libraries, memory compilers, and general-purpose I/Os (GPIOs) optimized for advanced process nodes at the leading foundries.

MSU Leveraging Intel 16 and the Cadence Tool Flow for Academic Chip Tapeout

08/22/2025 | Cadence Design Systems
Morgan State University (MSU) recently received an Apple Innovation Grant, designed to support engineering schools as they develop their silicon and hardware technologies. The New Silicon Initiative (NSI) is designed to inspire and prepare students for careers in hardware engineering, computer architecture, and silicon chip design.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in