-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSilicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
Mechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
OSI Systems Receives $10 Million Order to Provide Mobile Cargo and Vehicle Inspection Systems
July 30, 2024 | BUSINESS WIREEstimated reading time: Less than a minute
OSI Systems, Inc. announced that its Security division received an order from an international customer for approximately $10 million to provide the Company’s Z Backscatter® Van (ZBV®) cargo and vehicle inspection systems, including follow-on maintenance, training, and support. These inspection systems are expected to be deployed for border customs applications.
OSI Systems’ Chairman and CEO, Deepak Chopra, commented, “We look forward to delivering one of our most advanced and widely deployed security solutions. Our ZBV systems play a crucial role in enhancing border security, and we are excited to support our customer’s mission to ensure safe and secure borders.”
Suggested Items
Elementary, Mr. Watson: The Paradigm Shift of Silicon-to-System Design
09/18/2024 | John Watson -- Column: Elementary, Mr. WatsonImagine you were asked to build a city. What approach would you take? In the old way, city planners designed each building independently. They focused on making each building strong, aesthetically pleasing, and valuable. But they didn't always consider how all the buildings would fit together in the city. Roads, power lines, and parks were added later, sometimes making the city confusing or complicated to get around.
Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave
09/18/2024 | IntelThe Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.
Successful Rehm Technology Days 2024 – Where the Future Meets Technology
09/17/2024 | Rehm Thermal SystemsTraditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.
TPY-4 Radar Completes Successful Risk Reduction Tests, 3DELRR program one step closer to battlefield success
09/17/2024 | Lockheed MartinThe U.S. Air Force Three-Dimensional Expeditionary Long Rang Radar (3DELRR) program team and Lockheed Martin successfully accomplished risk reduction testing for the TPY-4 radar. This event demonstrated the radar’s performance in a variety of conditions.
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
09/16/2024 | IPCThe increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”