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In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
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Elevate Your Career With Technical Skills Training
August 1, 2024 | Kelly Allen, IPCEstimated reading time: 1 minute
Countless working individuals across the globe seek employment opportunities that foster personal and professional growth. According to Gallup research, 87% of millennials—the largest working generation in the U.S.—emphasize the importance of professional development and career advancement opportunities. Are you one of them?
IPC collaborates with seasoned industry professionals to offer top-tier, skill-based educational programs. Delivered by expert instructors with over 25 years of experience in the electronics industry and teaching, they convey the necessary concepts and skills to produce designs compliant with IPC standards, guide the development process, and satisfy complex customer demands.
IPC partners to assist professionals in assessing their career goals and identifying the necessary skills to achieve them. Our online courses offer technical knowledge covering the electronics industry, surrounding critical aspects from design and manufacturing to assembly and testing. IPC is your pathway to expanding your capabilities and enhancing your career by:
- Strengthening your expertise and broadening your impact within the electronics industry
- Keeping abreast of relevant industry topics to remain competitive
- Empowering yourself to excel in your current role
- Continuously enhancing your skills
As an industry leader in PCB design courses, IPC instills core design competencies, allowing you to demonstrate your understanding in a variety of courses, including Introduction to PCB Design I and II, PCB Design for Radio Frequency Boards, PCB Design for Rigid-flex Boards, PCB Design for Military & Aerospace Applications, and PCB Advanced Design Concepts.
To read the entire article, which originally appeared in the July 2024 Design007 Magazine, click here.
Suggested Items
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
09/16/2024 | IPCThe increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
ASC Sunstone Circuits to Exhibit at the Anaheim Electronics & Manufacturing Show (AEMS) 2024
09/16/2024 | ASC SunstoneAmerican Standard Circuits | ASC Sunstone will be exhibiting at the Anaheim Electronics & Manufacturing Show 2024 to be held October 2-3 at the Anaheim Conventions Center in Anaheim, California.
Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar
09/16/2024 | BUSINESS WIREOmni Design Technologies, a leading provider of high-performance, low-power data acquisition and signal-processing solutions, and Aura Intelligent Systems, a developer of high-resolution imaging radar for ADAS and autonomous vehicles, announced a partnership on Aura’s next generation digital radar development.
Comtech Launches New Digital Common Ground Modem Product Line for DoD and Coalition Customers
09/13/2024 | BUSINESS WIREComtech, a global technology leader, today announced the launch of the Company’s new Digital Common Ground (“DCG”) portfolio of modems.
AST SpaceMobile Announces Successful Orbital Launch of Its First Five Commercial Satellites
09/13/2024 | BUSINESS WIREAST SpaceMobile, Inc., the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones designed for both commercial and government use, announced the successful launch of its first five commercial satellites, called BlueBirds.