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Technica Showcases Partners and Announces TECH DAYS at Silicon Valley SMTA Expo & Tech Forum

12/05/2025 | Technica USA
Technica Corporation participated in this week’s Silicon Valley SMTA Expo & Tech Forum, joined by many of the company’s leading PCB assembly supply partners.

Essemtec Launches the Tarantula Dual Lane – Endless Versatility in Dispensing and Jetting

11/12/2025 | Essemtec
Essemtec proudly introduces the Tarantula Dual Lane, our most advanced dispensing platform designed to redefine flexibility, speed, and scalability in modern electronics production.

Redefining Solder Paste Application – Essemtec Reaches 1.1 Million Dots per Hour

11/06/2025 | Essemtec
Essemtec, the Swiss manufacturer of adaptive SMT and dispensing solutions, announces a major performance upgrade to its Jet-on-the-Fly High Speed solder paste jetting technology, now achieving 1.1 million dots per hour.

Essemtec Expands Presence in Mexico through Strategic Partnership with SMTVYS

09/29/2025 | Essemtec
Essemtec, a global leader in advanced automation solutions for electronics manufacturing, is proud to announce the start of a new collaboration with SMTVYS, a leading provider of industrial equipment and manufacturing solutions in Mexico.

Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area

07/28/2025 | Technica USA
Technica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
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