Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
SEMI EuroPAT Workshop to Highlight the Future of Semiconductor Packaging Manufacturing in Europe
August 6, 2024 | SEMIEstimated reading time: 1 minute
The EuroPAT Workshop, an annual event of the SEMI Integrated Packaging Assembly & Testing European Chapter Technology Community (ESiPAT-TC), taking place from 9-10 September, 2024 in Berlin, will feature manufacturing and supply chain trends for semiconductor packaging, assembly, and test in Europe. Themed Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing? , the third edition of the workshop will showcase collaboration among Outsourced Semiconductor Assembly and Test (OSAT) providers and Semiconductor Packaging, Assembly, and Test Service Providers (SPAT-SPs) that is instrumental for the resilience of Europe’s microelectronics industry. Registration is open.
SEMIAs the complexity of semiconductor technologies increases, collaborative Chip-Package-Board-System co-design is becoming a focal point for Integrated Device Manufacturers (IDMs) and Original Equipment Manufacturers (OEMs). Workshop attendees will deep dive into this complex framework and explore the future of electronics packaging, assembly, and test. Additionally, the workshop will disseminate results of the Pack4EU, a European funded project assessing the current status and evolving needs of packaging, assembly, and test in Europe.
"SEMI Europe looks forward to welcoming leading packaging, assembly and test experts to the EuroPAT Workshop in Berlin," said Laith Altimime, President of SEMI Europe. “The exceptional lineup of speakers will offer insights into vital trends for semiconductor packaging manufacturing.”
This year’s EuroPAT Workshop will be hosted by Swissbit Germany AG on day one and the Mercure Hotel MOA on day two. The workshop will present a broad scope of topics including:
- Packaging, assembly and test manufacturing in Europe
- The role of European OSATs and SPAT-SPs
- Semiconductor packaging supply chain
- EU Chips Act updates for packaging
- Coordination and Support Action (CSA) and Pack4EU Chips Joint Undertaking (Chips JU) updates
- European markets and applications strengths and weaknesses
- Technology transfer from pilot lines in RTO and industrial pilot lines
- Collaboration in open advanced packaging piloting facilities
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.
Coastal RF Systems Joins StratEdge’s Network as Manufacturer’s Representative for Southern California
10/31/2024 | StratEdgeStratEdge Corporation, a leader in high-performance semiconductor packaging solutions, has appointed Coastal RF Systems as its exclusive Manufacturer's Representative for Southern California.
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
10/23/2024 | SEMISEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.