Connect the Dots: Designing for Reality—Surface Finish
Fresh PCB Concepts: Tariffs and the Importance of a Diverse Supply Chain
Elementary Mr. Watson: The Road Ahead—Advances in PCB Design Technology
SEMI EuroPAT Workshop to Highlight the Future of Semiconductor Packaging Manufacturing in Europe
August 6, 2024 | SEMIEstimated reading time: 1 minute
The EuroPAT Workshop, an annual event of the SEMI Integrated Packaging Assembly & Testing European Chapter Technology Community (ESiPAT-TC), taking place from 9-10 September, 2024 in Berlin, will feature manufacturing and supply chain trends for semiconductor packaging, assembly, and test in Europe. Themed Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing? , the third edition of the workshop will showcase collaboration among Outsourced Semiconductor Assembly and Test (OSAT) providers and Semiconductor Packaging, Assembly, and Test Service Providers (SPAT-SPs) that is instrumental for the resilience of Europe’s microelectronics industry. Registration is open.
SEMIAs the complexity of semiconductor technologies increases, collaborative Chip-Package-Board-System co-design is becoming a focal point for Integrated Device Manufacturers (IDMs) and Original Equipment Manufacturers (OEMs). Workshop attendees will deep dive into this complex framework and explore the future of electronics packaging, assembly, and test. Additionally, the workshop will disseminate results of the Pack4EU, a European funded project assessing the current status and evolving needs of packaging, assembly, and test in Europe.
"SEMI Europe looks forward to welcoming leading packaging, assembly and test experts to the EuroPAT Workshop in Berlin," said Laith Altimime, President of SEMI Europe. “The exceptional lineup of speakers will offer insights into vital trends for semiconductor packaging manufacturing.”
This year’s EuroPAT Workshop will be hosted by Swissbit Germany AG on day one and the Mercure Hotel MOA on day two. The workshop will present a broad scope of topics including:
- Packaging, assembly and test manufacturing in Europe
- The role of European OSATs and SPAT-SPs
- Semiconductor packaging supply chain
- EU Chips Act updates for packaging
- Coordination and Support Action (CSA) and Pack4EU Chips Joint Undertaking (Chips JU) updates
- European markets and applications strengths and weaknesses
- Technology transfer from pilot lines in RTO and industrial pilot lines
- Collaboration in open advanced packaging piloting facilities
Share on:
Suggested Items
Koh Young Partners with NTV USA to Expand its Advanced Packaging and Semiconductor Inspection Solutions in the United States
01/28/2025 | Koh YoungKoh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry.
TRUMPF, SCHMID Group Enable Cost-effective High-speed Chips
01/24/2025 | SCHMID GroupTRUMPF and the SCHMID Group are developing an innovative manufacturing process for the latest microchip generation for the global chip industry.
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
01/24/2025 | GlobalFoundriesGlobalFoundries (GF) announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility.
iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection
01/23/2025 | iNEMIRegister today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.
KYZEN to Feature MICRONOX MX2123 Power Module Cleaner at iMAPS Wire Bonding Workshop
01/22/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview.