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Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3

04/22/2026 | Anaya Vardya, American Standard Circuits
Parts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.

New Guidance Targets Scope 3.1 Emissions Gap in Electronics Supply Chains

04/22/2026 | I-Connect007 Editorial Team
A new industry guidance document aimed at improving how electronics companies account for Scope 3 Category 1 (Scope 3.1) emissions marks a significant step toward more consistent and effective supply chain decarbonization. A recent webinar hosted by the Global Electronics Association and the Responsible Business Alliance (RBA) addressed a persistent challenge: Despite the material impact of Scope 3.1 emissions, fewer than half of electronics companies currently report them.

Mexico’s Wire Harness Pivot Point

04/22/2026 | Nolan Johnson, SMT007 Magazine
Mexico is a major producer of wire harnesses, but recent U.S. economic policies and Mexico’s domestic issues have had a ripple effect on the industry. Jesus Duarte, vice president of Mexico Assembly Wire Technology and president of Expo Wire Tech, explains the issue in greater depth and how the wire harness industry should respond on its own, rather than just reflect what Tier 1s are doing.

EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates

04/21/2026 | Alison James and Chris Mitchell, Global Electronics Association
The European Commission has published a call for proposals under the European Defence Industry Programme (EDIP), and for European electronics manufacturers the message is clear: this is real money for real capacity, and PCBs and IC substrates are explicitly in scope. EDIP's Industrial Reinforcement Actions (IRA) dedicate €122.25 million to key electronic components, covering guidance electronics, propulsion electronics, RF and laser modules, multispectral cameras, avionics, PCBs and IC substrates, lithium-ion polymer batteries, power electronics, and critical semiconductor building blocks

Women in Technology: Learning to Just Be Myself

04/21/2026 | Michelle Te, I-Connect007
Approximately 100 women and a handful of men gathered for a Women in Electronics evening event at APEX EXPO. As I wandered among the tables before it started, I stopped to chat with several women all wearing purple and white polo shirts emblazoned with the TTM logo. It turns out they are part of TTM’s Women in Technology Group, so I sat down and invited them to share their thoughts on coming to the event and what it means to be part of the electronics industry.
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