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My Top 10 Highlights from IPC APEX EXPO 2025
April 3, 2025 | Chris Mitchell, IPC VP, Global Government RelationsEstimated reading time: 6 minutes
Every year, I am reminded what an exciting and fast-paced whirlwind IPC APEX EXPO is—the friends you run into, the new people you meet, the innovations you encounter, and the fascinating discussions you dive into. It’s certainly true that our industry is driven by searchers and problem-solvers, creating endless opportunities at APEX EXPO to connect, collaborate, and shape the future.
Every year, I track the technologies, topics, and moments that capture my attention and distill them into my annual Top 10 APEX EXPO Highlights. So, without further ado, here we go:
1. IPC launches Evolve to boost sustainability and unveils new industry report.
IPC reintroduced its sustainability program under the new name Evolve, reflecting IPC’s partnership with the electronics industry to advance an exciting, ambitious agenda. Spurred on by our members, IPC is working to accelerate sustainability in electronics manufacturing, giving companies the tools, resources, and connections they need to make real progress. In conjunction with the launch, IPC also released its latest report, Wired for Change, which revealed that nearly 60% of the industry is doubling down on sustainability, seeing it as a long-term investment rather than just a regulatory hurdle. Congratulations to the entire Evolve team and to the hundreds of industry volunteers who have helped to advance this important initiative.
2. IPC CEO Dr. John W. Mitchell shares vision for industry collaboration amid global tensions.
John Mitchell’s keynote tackled a timely and increasingly important issue: promoting global collaboration while protecting national interests. He praised APEX EXPO attendees as today’s authors of knowledge and drivers of innovation, and he highlighted the industry’s natural tendency to share knowledge restrained only by corporate and national barriers. Mitchell urged attendees to get involved in our knowledge-sharing community and to champion “gates and bridges” through the walls being built today. These connections, he emphasized, are essential for advancing technology, protecting the planet, and securing a better future for the next generation.
3. USPAE and IPC cohost meeting to unite the industry behind shared defense electronics priorities.
The Department of Defense’s Executive Agent for Printed Circuit Boards was forced to cancel the Defense Electronics Roundtable event that they traditionally host each year during APEX EXPO. Instead, the U.S. Partnership for Assured Electronics (USPAE) and IPC cohosted an interactive session with over 40 participants to address our shared priorities. Participants discussed critical technology gaps and their effects on defense, national security, and economic livelihoods. USPAE and IPC are now drafting a statement of industry priorities based on the meeting, which will be shared with the participants for further feedback. If you are interested in getting involved, reach out to USPAE’s Jim Will or IPC’s Rich Cappetto.
4. APEX EXPO features first-ever Mexico Pavilion.
APEX EXPO has long attracted attendees and exhibitors from Mexico, but this year, for the first time, the show floor featured a Mexico Pavilion. This special exhibition area was made possible through collaboration among Mexico’s leading electronics manufacturers, government officials, and educational leaders from the states of Guanajuato and Querétaro. The pavilion highlighted the excitement surrounding Mexico’s large and rapidly growing electronics manufacturing industry and IPC’s role in uniting stakeholders to develop a skilled workforce. Kudos to IPC’s Lorena Villanueva and the Mexico team for showcasing the industry’s remarkable progress.
5. The EMS Summit gets better and better.
The caliber of discussions and presentations at the EMS Summit just gets better and better every year, thanks to the great work of IPC’s Mark Wolfe and Tracy Riggan, as well as the leadership of Out of the Box Manufacturing COO Allison Budvarson. The GR team always appreciates the opportunity to update the participants on policy developments in Washington and around the world, but a compelling agenda featuring industry experts kept me in the room to better understand emerging market trends and industry concerns.
6. New board members reflect our global and forward-looking outlook.
Each year at APEX EXPO, IPC hosts its official annual meeting, during which new board members are announced. This year, IPC John Mitchell welcomed three new board members—Markus Aschenbrenner of Zollner Elektronik, Frank McKay of Jabil, and Gunter Lauber of ASMPT—reinforcing IPC’s commitment to global innovation and supply chain resilience. He also welcomed Emily Daley of Michigan Technological University as this year’s Student Board Member. I had the pleasure of speaking with Emily and look forward to seeing her represent the views of our industry’s future leaders.
7. The topic of artificial intelligence dominated just about every meeting.
To say that AI is a hot topic is hardly a hot take. But, amidst the often-inane babble about the impact of AI on the world, it was great to be with our community having substantive and revelatory discussions about the many ways AI is transforming electronic design, manufacturing, and supply chain management. I had the opportunity to join a panel discussion hosted by Trevor Galbraith of Global SMT & Packaging, during which Luminovo CEO Timon Ruban suggested that no technology will be more important during the next five years. The challenge for our industry, of course, is how to integrate AI such that it delivers the ROI promised.
8. The most surprising topic at APEX EXPO: politics.
Politics isn’t usually front and center at IPC APEX EXPO, but this year, it was impossible to ignore as companies expressed concern over new U.S. and international tariffs and their ripple effects. Many worried that the new trade barriers could throw a wrench in supply chains, drive up costs, and make it harder for domestic manufacturing to stay competitive. With so much uncertainty, industry leaders were talking to IPC’s GR team and with each other about how to keep business on track amid such tremendous tumult.
9. The topic that’s taking root: advanced electronics packaging.
IPC’s Matt Kelly and Devan Iyer hosted sessions on advanced packaging, just as IPC has done the prior two years. But this year, I saw a far more holistic and urgent approach to packaging. Working with the industry, Matt and Devan have expanded the discussion to include not just the packaging of the chip but also the integration of the chip onto the printed circuit board, which they call “advanced electronics packaging.” By calling it out, they hope to ensure that advancements in PCB and assembly technologies keep pace with the advancements in semiconductor technology. The Thursday sessions had great participation and presentations, although I confess much of it was over my head. Advanced electronics packaging is driving discussion within our own industry and also sparking interest among government officials, who want to understand how they can support the delivery of advanced electronic systems, not just components.
10. Industry Leader and Statesman Peter Bigelow Inducted into the IPC Hall of Fame.
I was thrilled to see Peter Bigelow inducted into the IPC Raymond E. Pritchard Hall of Fame—a huge and well-deserved honor. His dedication to IPC—from serving on technical committees to helping drive critical industry initiatives—has made a lasting impact on our industry. He’s also been an invaluable resource to IPC’s advocacy and industry intelligence teams. It’s always great to see such amazing leadership recognized.
Each year, I leave APEX EXPO feeling very energized, with a long list of follow-up assignments and meetings. Over time, I’ve come to see the length of that list as a measure of my engagement at the show. For those who attended this year, I hope your list is just as long. See you all next year.
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04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.
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Mexico’s Wire Harness Pivot Point
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EDIP Opens the Door: EU Funding Now Available for Defence Electronics Including PCBs and Substrates
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Women in Technology: Learning to Just Be Myself
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