-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
IDC: Semiconductor Foundry 2.0 Market is Entering the Growth Phase from Recovery with 11% YoY Growth in 2025
March 24, 2025 | IDCEstimated reading time: 2 minutes
According to IDC ’s Worldwide Semiconductor Supply Chain Tracking Intelligence latest report, the global semiconductor market, following a recovery in 2024, is expected to experience steady growth in 2025. The broadly defined Foundry 2.0 market— encompassing foundry, non-memory IDM, OSAT, and photomask making—is projected to reach a market size of $298 billion in 2025, with year-over-year growth of 11%, signaling a transition from a recovery phase in 2024 to a growth phase in 2025. Over the long term, the compound annual growth rate (CAGR) from 2024 to 2029 is projected to reach 10%. This growth is catalyzed by the continuous rise in AI demand and a gradual recovery in non-AI demand.
The foundry sector remains the core driver of semiconductor manufacturing. Industry leader TSMC (Taiwan Semiconductor Manufacturing Company) leverages its technological edge in advanced nodes below 5nm and advanced packaging CoWoS, securing robust orders for AI accelerator manufacturing. With utilization consistently at full load, TSMC is expected to expand its market share in the Foundry 2.0 market to 37% in 2025.
While other foundry manufacturers face pressure from price erosion in mature nodes, the rebound in demand for consumer electronics—such as smartphones, PCs, notebooks, TVs, and wearables—has driven a projected 4% average increase in utilization for mature nodes. This resurgence fuels a significant expansion of the overall foundry market, expected to grow by 18% in 2025.
Non-Memory IDM Faces Challenges
The non-memory IDM (Integrated Device Manufacturer) sector, hampered by insufficient deployment in AI accelerators, will experience limited expansion in 2025. Intel is aggressively promoting its process technologies, particularly the 18A process alongside Intel 3/Intel 4 processes, which are anticipated to maintain its market share in the Foundry 2.0 market at approximately 6%.
Meanwhile, IDM specializing in automotive and industrial sectors—such as Infineon, Texas Instruments, STMicroelectronics, and NXP—have completed inventory adjustments. However, market demand is expected to remain weak in the first half of 2025, with stabilization projected for the second half. Collectively, these factors limit the overall non-memory IDM sector to a modest growth of 2% in 2025.
OSAT Welcomes AI-Driven Growth
The Outsourced Semiconductor Assembly and Test (OSAT) sector is benefiting from IDMs increasing outsourcing to foundry due to advanced nodes demands, shifting packaging and testing needs to OSAT vendors. While traditional packaging and testing businesses remain lukewarm, the strong demand for AI accelerators has spurred a rise in advanced packaging orders. Vendors such as SPIL (under ASE), Amkor, and KYEC are actively taking on more CoWoS-related orders, collectively driving the overall OSAT industry to an expected growth of 8% in 2025.
“The semiconductor manufacturing chain is entering a new wave of expansion. AI continues to drive demand for advanced nodes and advanced packaging, while traditional application markets gradually recover, presenting the industry with diversified development opportunities,” said Galen Zeng, senior research manager at IDC Asia/Pacific. “However, the industry must navigate multiple variables, including geopolitical risks, national policies (such as China’s consumption stimulus measures, U.S. factory construction subsidies, and potential U.S. chip tariffs), supply-demand fluctuations from new capacity, and the commercialization progress of AI applications. These factors will shape the long-term development trajectory of the semiconductor industry."
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards
04/16/2026 | Real Time with... APEX EXPOAt APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
Regional Electronics Growth and Initiatives with Gaurab Majumdar
04/14/2026 | Real Time with... APEX EXPONolan Johnson interviews Gaurab Majumdar, vice president of Global Electronics Association India and South East Asia, about positive developments in the regions he oversees. Key initiatives include an MoU with India's Ministry of Defense for a PCB test lab in Bangalore and workforce development programs in Southeast Asia. These efforts aim to bolster local industries, reduce costs, and foster self-sufficiency in semiconductors and PCBs.
Boeing Delivers ViaSat-3 Flight 3 Spacecraft to Viasat
04/13/2026 | BoeingBoeing announced, delivery of the ViaSat-3 Flight 3 (VS-3 F3) spacecraft to Viasat. Built on Boeing’s high-power 702MP+ platform and integrated at Boeing’s El Segundo facility in California.