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Suggested Items

Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress

08/04/2025 | Michael Carano -- Column: Trouble in Your Tank
Metallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.

Preventing Surface Prep Defects and Ensuring Reliability

06/10/2025 | Marcy LaRont, PCB007 Magazine
In printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.

The Chemical Connection: Surface Finishes for PCBs

03/31/2025 | Don Ball -- Column: The Chemical Connection
Writing about surface finishes brings a feeling of nostalgia. You see, one of my first jobs in the industry was providing technical support for surface cleaning processes and finishes to enhance dry film adhesion to copper surfaces. I’d like to take this opportunity to revisit the basics, indulge in my nostalgia, and perhaps provide some insight into why we do things the way we do them in the here and now.

PCB007 Magazine: The Essential Guide to Surface Finishes—March 2025

03/17/2025 | I-Connect007 Editorial Team
In the March 2025 issue of PCB007 Magazine, we go back to basics, recount a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. 

Unlocking Advanced Circuitry Through Liquid Metal Ink

10/31/2024 | I-Connect007 Editorial Team
PCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
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