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CACI Wins $416M Contract for U.S. Army SIGINT Missions
August 8, 2024 | CACI International Inc.Estimated reading time: Less than a minute
CACI International Inc announced that it has been awarded a five-year technology task order valued at up to $416 million to design, produce, and deliver complex, customized radio frequency (RF) systems for U.S. Army’s signals intelligence (SIGINT) missions.
“SIGINT has always been essential to intelligence missions. However, as multi-domain threats evolve at a moment’s notice, the Army requires superior integration of modern technologies at the tactical edge,” said John Mengucci , CACI President and Chief Executive Officer. “By utilizing our cutting-edge hardware and software systems and our expert analysis, we will give warfighters operational agility through enhanced situational awareness and force protection, as well as increased capacity to outpace our adversaries.”
As part of the Exploit, Enhance, Enable and Influence-TENCAP (E3I-T) work, CACI will begin deploying new, upgraded systems this year. The company will also help the Army to address evolving risks through SIGINT data analysis feeds.
CACI has a demonstrated history of delivering DoD and IC capabilities with more than 700 systems deployed globally. CACI’s SIGINT capabilities leverage the largest signals library in the world combined with precision techniques and technology for highly effective collection, processing, and information dissemination.
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10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
Light-curable Solutions for Reliable Electronics in Space Applications
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Elementary, Mr. Watson: High Power: When Physics Becomes Real
10/15/2025 | John Watson -- Column: Elementary, Mr. WatsonHave you ever noticed how high-speed design and signal integrity classes are always packed to standing room only, but just down the hall, the session on power electronics has plenty of empty chairs? It's not just a coincidence; it's a trend I've observed over the years as both an attendee and instructor.
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Bluepath Robotics Optimizes AMR Fleets with Inductive Charging Solution from Wiferion
10/09/2025 | WiferionIn a dynamic and highly competitive industry such as logistics, efficient and uninterrupted material flows are of crucial importance. To ensure maximum uptime for its robots, Bluepath Robotics, which specializes in autonomous mobile robots (AMR), needed a reliable and powerful power supply.