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CACI Wins $416M Contract for U.S. Army SIGINT Missions
August 8, 2024 | CACI International Inc.Estimated reading time: Less than a minute
CACI International Inc announced that it has been awarded a five-year technology task order valued at up to $416 million to design, produce, and deliver complex, customized radio frequency (RF) systems for U.S. Army’s signals intelligence (SIGINT) missions.
“SIGINT has always been essential to intelligence missions. However, as multi-domain threats evolve at a moment’s notice, the Army requires superior integration of modern technologies at the tactical edge,” said John Mengucci , CACI President and Chief Executive Officer. “By utilizing our cutting-edge hardware and software systems and our expert analysis, we will give warfighters operational agility through enhanced situational awareness and force protection, as well as increased capacity to outpace our adversaries.”
As part of the Exploit, Enhance, Enable and Influence-TENCAP (E3I-T) work, CACI will begin deploying new, upgraded systems this year. The company will also help the Army to address evolving risks through SIGINT data analysis feeds.
CACI has a demonstrated history of delivering DoD and IC capabilities with more than 700 systems deployed globally. CACI’s SIGINT capabilities leverage the largest signals library in the world combined with precision techniques and technology for highly effective collection, processing, and information dissemination.
Suggested Items
Elementary, Mr. Watson: The Paradigm Shift of Silicon-to-System Design
09/18/2024 | John Watson -- Column: Elementary, Mr. WatsonImagine you were asked to build a city. What approach would you take? In the old way, city planners designed each building independently. They focused on making each building strong, aesthetically pleasing, and valuable. But they didn't always consider how all the buildings would fit together in the city. Roads, power lines, and parks were added later, sometimes making the city confusing or complicated to get around.
Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave
09/18/2024 | IntelThe Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.
Successful Rehm Technology Days 2024 – Where the Future Meets Technology
09/17/2024 | Rehm Thermal SystemsTraditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.
TPY-4 Radar Completes Successful Risk Reduction Tests, 3DELRR program one step closer to battlefield success
09/17/2024 | Lockheed MartinThe U.S. Air Force Three-Dimensional Expeditionary Long Rang Radar (3DELRR) program team and Lockheed Martin successfully accomplished risk reduction testing for the TPY-4 radar. This event demonstrated the radar’s performance in a variety of conditions.
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
09/16/2024 | IPCThe increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”