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A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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Are You Ensuring PCB Durability? Dive into Solder Mask and Legend on 'On the Line With…’ Podcast
August 12, 2024 | I-Connect007Estimated reading time: Less than a minute
Don't miss the latest episode of "On the Line With… ASC Sunstone: Designing for Reality," featuring ASC Sunstone’s Matt Stevenson as we delve deeper into the PCB manufacturing process. With a functioning PCB in hand, there’s still essential work to protect it from environmental effects and document the circuit components. This episode focuses on the crucial steps of applying solder mask and silkscreen.
This series is a trove of valuable insights for anyone involved in circuit boards manufacturing with expert tips and tricks for optimizing design, improving fabrication, boosting yields, and cutting costs.
I-Connect007 delivers top-tier digital content tailored to the electronics industry, from magazines and books to newsletters, market reports, podcasts, and event coverage. As the industry’s longest-running digital media company, we are the leading source of original content for the global electronics community.
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Atg Launches Latest Large Format Test System, A9XL, with 8 Heads and 48” x 26” Panel Capability
08/01/2025 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH (a Mycronic company) is proud to roll out a new large format test system generation based on the latest high speed atg A9 (board size up to 24” x 21”) and A9L platform.
Advint and Sayron Bring Advanced Rectifier Solutions to High-Reliability PCB Manufacturers
08/01/2025 | Advint IncorporatedAdvint Incorporated has partnered with Sayron, a leading global rectifier manufacturer, to supply cutting-edge IGBT-based DC rectifiers to high-performance PCB manufacturers across North America and beyond. Sayron’s precision-engineered rectifiers align with the stringent requirements of advanced PCB processes.
Direct Metallization: A Sustainable Shift in PCB Fabrication
07/31/2025 | Jim Watkowski, Harry Yang, and Mark Edwards, MacDermid Alpha Electronics SolutionsThe global electronics industry is undergoing a significant transformation, driven by the need for more resilient supply chains and environmentally sustainable manufacturing practices. Printed circuit boards (PCBs), the backbone of interconnection for electronic devices, are at the center of this shift. Traditionally, PCB fabrication has relied heavily on electroless copper, a process that, while effective, is resource-intensive and environmentally hazardous. In response, many manufacturers are turning to direct metallization technologies as a cleaner, more efficient alternative.
MacDermid Alpha Electronics Solutions Unveils Unified Global Website to Deepen Customer, Talent, and Stakeholder Engagement
07/31/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronics Solutions, the electronics business of Elements Solutions Inc, today launched macdermidalpha.com - a unified global website built to deepen digital engagement. The launch marks a significant milestone in the business’ ongoing commitment to delivering more meaningful, interactive, and impactful experiences for its customers, talent, and stakeholders worldwide.
Solving the Toughest BGA Challenges in Electronics
07/30/2025 | Nash Bell, BEST Inc.Since the late 1990s, ball grid array (BGA) packages have emerged as a preferred package style for electronic devices. Compared with high-density ultra-fine pitch quad flat packs (QFPs), BGA packages significantly reduce the required footprint on printed circuit boards (PCBs) by approximately 50%.