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Are You Ensuring PCB Durability? Dive into Solder Mask and Legend on 'On the Line With…’ Podcast
August 12, 2024 | I-Connect007Estimated reading time: Less than a minute
Don't miss the latest episode of "On the Line With… ASC Sunstone: Designing for Reality," featuring ASC Sunstone’s Matt Stevenson as we delve deeper into the PCB manufacturing process. With a functioning PCB in hand, there’s still essential work to protect it from environmental effects and document the circuit components. This episode focuses on the crucial steps of applying solder mask and silkscreen.
This series is a trove of valuable insights for anyone involved in circuit boards manufacturing with expert tips and tricks for optimizing design, improving fabrication, boosting yields, and cutting costs.
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Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Zhen Ding Holding Posts September 2025 Monthly Revenue Report
10/10/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported September 2025 revenue of NT$19,362 million, up 32.15% MoM and up 0.13% YoY, marking the second-highest level for the same period in company history.
Green Circuits Boosts Midwest Presence with New Regional Sales Manager Ray Ponder
10/08/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced the appointment of Ray Ponder as Regional Sales Manager for the Midwest region.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.