-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Solderstar to Present Advanced Reflow Profiling Solution at SMTA International 2024
August 8, 2024 | SolderStarEstimated reading time: 1 minute

Solderstar, a leader in innovative profiling solutions for the electronics manufacturing industry, is exhibiting at the SMTA International 2024 conference in Rosemont, Illinois, booth 2838, from October 22-24. This prestigious event will provide Solderstar with a platform to connect with industry leaders and showcase their state-of-the-art Reflow Shuttle, which now features crucial oxygen (O2) measurement capabilities.
SMTA International is known for presenting the latest innovations, solutions, and expertise that are shaping the future of the electronics industry. Solderstar's exhibit will highlight their continued commitment to providing advanced solutions designed to enhance manufacturing processes.
The Reflow Shuttle has been a focal point of Solderstar’s recent trade show presentations. This comprehensive profiling solution now includes all five essential measurements required for precision in reflow soldering: O2 ppm, vibration levels in three axes, vacuum, temperature profiles, and conveyor speed.
Keith Blakeley, Solderstar Sales Manager, said: "O2 levels are crucial in the reflow process, as they can affect solder joint quality. High levels of O2 can lead to oxide formation, weakening the solder joint and increasing susceptibility to failure. Additionally, O2 can cause de-wetting, preventing a good bond with the PCB.
“By precisely measuring oxygen levels and maintaining them below critical thresholds, the Reflow Shuttle ensures strong and reliable solder joints, reduces solder wastage, and optimizes nitrogen usage. This comprehensive approach increases product quality and manufacturing efficiency, equipping manufacturers with real-time insights into their reflow soldering processes and enabling informed decision-making and operational optimization.
“We are looking forward to presenting the Reflow Shuttle O2 measurement module at SMTA International and demonstrating how our solutions can significantly improve manufacturing processes.”
Suggested Items
Indium to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025
05/19/2025 | Indium CorporationAs a trusted leader in materials science for advanced electronics assembly, Indium Corporation® is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore.
Indium Wins EM Asia Innovation Award
05/01/2025 | Indium CorporationIndium Corporation, a leading materials provider for the electronics assembly market, recently earned an Electronics Manufacturing (EM) Asia Innovation Award for its new high-reliability Durafuse® HR alloy for solder paste at Productronica China in Shanghai.
SolderKing Enhances Brainboxes' Electronics Manufacturing with Expert Support and Advanced Materials
03/26/2025 | SolderKingIn modern electronics manufacturing, success relies on more than high-quality soldering materials. Technical knowledge and process expertise are just as crucial for achieving consistent results. SolderKing, a leading UK manufacturer, provides both, combining advanced consumables with specialist support to help manufacturers optimise their soldering processes.
Altus Supplies Dual Lane Reflow Oven to Triple CEM’s Production Capacity
03/20/2025 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has partnered with Garner Osborne Circuits, a UK-based Contract Electronics Manufacturer, to install a Dual Lane Heller 1707 MK7 reflow oven.
Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025
02/04/2025 | SolderStarSolderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.