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Solderstar to Present Advanced Reflow Profiling Solution at SMTA International 2024
August 8, 2024 | SolderStarEstimated reading time: 1 minute
Solderstar, a leader in innovative profiling solutions for the electronics manufacturing industry, is exhibiting at the SMTA International 2024 conference in Rosemont, Illinois, booth 2838, from October 22-24. This prestigious event will provide Solderstar with a platform to connect with industry leaders and showcase their state-of-the-art Reflow Shuttle, which now features crucial oxygen (O2) measurement capabilities.
SMTA International is known for presenting the latest innovations, solutions, and expertise that are shaping the future of the electronics industry. Solderstar's exhibit will highlight their continued commitment to providing advanced solutions designed to enhance manufacturing processes.
The Reflow Shuttle has been a focal point of Solderstar’s recent trade show presentations. This comprehensive profiling solution now includes all five essential measurements required for precision in reflow soldering: O2 ppm, vibration levels in three axes, vacuum, temperature profiles, and conveyor speed.
Keith Blakeley, Solderstar Sales Manager, said: "O2 levels are crucial in the reflow process, as they can affect solder joint quality. High levels of O2 can lead to oxide formation, weakening the solder joint and increasing susceptibility to failure. Additionally, O2 can cause de-wetting, preventing a good bond with the PCB.
“By precisely measuring oxygen levels and maintaining them below critical thresholds, the Reflow Shuttle ensures strong and reliable solder joints, reduces solder wastage, and optimizes nitrogen usage. This comprehensive approach increases product quality and manufacturing efficiency, equipping manufacturers with real-time insights into their reflow soldering processes and enabling informed decision-making and operational optimization.
“We are looking forward to presenting the Reflow Shuttle O2 measurement module at SMTA International and demonstrating how our solutions can significantly improve manufacturing processes.”
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