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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Keys to Successful ECAD-MCAD Collaboration
August 8, 2024 | Stephen V. Chavez, Siemens EDAEstimated reading time: Less than a minute
As PCB designs grow in scope and complexity, collaboration between the electronics and mechanical domains is a necessity. At the same time, smaller IC packages and more tightly packed PCBs compel electronics system development companies to think more about the mechanical form factor of items and recognize the importance of collaboration between MCAD and ECAD.
For example, as PCB designs face tighter requirements, problems resulting from electromechanical interference are becoming more common. Handling these kinds of problems across disciplines requires real-time collaboration—facilitated by automated tools and flows—and synchronized data.
An integrated ECAD/MCAD collaboration environment enables electrical and mechanical design teams to work together throughout the entire design process in real time, sharing cross-domain information incrementally and as changes occur. In this way, ECAD and MCAD collaboration allows teams to stayed synced and spot and correct errors or issues as they occur.
To read the entire article, which originally appeared in the July 2024 Design007 Magazine, click here.
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Cadence, Google Scale AI Chip Design with ChipStack on Google Cloud
04/16/2026 | Cadence Design SystemsCadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud.
CEA-Leti, CEA-List & PSMC Integrate RISC-V and MicroLED Silicon Photonics for 3D AI Systems
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Limtronik, VIDEOTON Unite Expertise to Boost U.S. Electronics Manufacturing
03/31/2026 | VideotonElectronics manufacturer Limtronik, which joined the Hungary-based VIDEOTON Group in 2025, is intensifying operational collaboration within the Group’s international production network.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.