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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
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Keys to Successful ECAD-MCAD Collaboration
August 8, 2024 | Stephen V. Chavez, Siemens EDAEstimated reading time: Less than a minute
As PCB designs grow in scope and complexity, collaboration between the electronics and mechanical domains is a necessity. At the same time, smaller IC packages and more tightly packed PCBs compel electronics system development companies to think more about the mechanical form factor of items and recognize the importance of collaboration between MCAD and ECAD.
For example, as PCB designs face tighter requirements, problems resulting from electromechanical interference are becoming more common. Handling these kinds of problems across disciplines requires real-time collaboration—facilitated by automated tools and flows—and synchronized data.
An integrated ECAD/MCAD collaboration environment enables electrical and mechanical design teams to work together throughout the entire design process in real time, sharing cross-domain information incrementally and as changes occur. In this way, ECAD and MCAD collaboration allows teams to stayed synced and spot and correct errors or issues as they occur.
To read the entire article, which originally appeared in the July 2024 Design007 Magazine, click here.
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