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AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Ohio Valley Expo & Tech Forum
August 13, 2024 | AIMEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Michigan Expo & Tech Forum taking place on August 29 at the Embassy Suites by Hilton Cleveland-Rockside in Independence, Ohio. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
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