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Suggested Items

Bringing Standards-based Thinking Earlier Into Rigid-flex Design

11/12/2026 | Peter Tranitz, Global Electronics Association
Rigid-flex designs are helping electronics manufacturers meet growing demands for smaller, lighter, and more reliable products. From aerospace and defense systems to medical devices, industrial electronics, automotive applications and advanced consumer products, rigid-flex technology can provide important advantages in packaging density, weight reduction and interconnect reliability. But rigid-flex design also raises the stakes.

Built for What’s Next: The End of Flat Thinking

11/05/2026 | Michael Gleason -- Column: Built for What’s Next
Advanced PCB design increasingly brings electrical performance, thermal behavior, mechanical requirements, material selection, and manufacturability into the same conversation. The board sits within a larger physical system, and each decision can influence how that system performs. Looking at those relationships together creates more opportunity to optimize the design as a whole.

October I-Connect007 Magazine Spotlights MKS Inc. and PCB Manufacturing Challenges

10/15/2026 | I-Connect007 Editorial Team
Go inside MKS Inc., explore Thailand’s growing PCB industry, and find practical guidance on design and manufacturing challenges, from signal integrity and ceramic substrates to putting AI into factory operations.

I-Connect007 Welcomes Michael Gleason as New Columnist

10/14/2026 | I-Connect007
I-Connect007 welcomes Michael Gleason, director of product development and strategic growth at GreenSource Fabrication, as its newest columnist. His monthly column, Built for What’s Next, will appear in I-Connect007 Magazine, offering a forward-looking perspective on PCB design, advanced manufacturing, and the technologies shaping the next generation of electronics. With more than 20 years of experience in PCB manufacturing, Gleason brings a combination of engineering expertise, operational leadership, and practical knowledge of advanced fabrication.

Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.
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