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Semiconductor Industry Experts to Present Solutions to Boost Performance at Advanced Packaging Summit in Korea
August 21, 2024 | SEMIEstimated reading time: Less than a minute
With innovations in advanced packaging crucial to enhancing semiconductors for AI, high-performance computing (HPC) and other leading-edge applications, the Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.
Organized by SEMI Korea, Advanced Packaging Summit 2024 will bring together leaders from companies such as Intel, Samsung, and SK hynix to explore topics including 2.5D packaging, chiplet packaging, co-packaged optics (CPO) and flip-chip ball grid array (FCBGA) substrate technologies. The Summit will feature a panel discussion that will examine how advanced packaging can help meet the performance demands of AI and HPC.
Agenda Topics and Presenters
- The Journey of the Semiconductor Industry and the Innovation of Advanced Packaging - Heejoung Joun, Samsung Electronics
- CPO (Co-Packaged Optics) - David Harame, AIM Photonics
- Advanced Packaging Technology for HBM and 2.5D SiP - Ho-Young Son, SK hynix
- Enabling the AI Era - Jinyoung Jeon, ASMPT
- The Role of Advanced Packaging Technology for AI - SungSoon Park, Intel
- FCBGA Substrate Technologies for AI/HPC - Mooseong Kim, LG Innotek
- Advanced Packages for Chiplets - TaeKyeong Hwang, Amkor Technology Korea
- Glass Substrates - Prof. Bongyoung Yoo, Hanyang University
Suggested Items
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
09/16/2024 | IPCThe increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
From Silicon to Systems
09/10/2024 | Andy Shaughnessy, Design007 MagazineFor the past few years, IPC has been championing the term “silicon to systems.” More than a buzzword, it has become a slogan—and even a kind of roadmap—for the organization. The term comes in especially handy when IPC is advocating for this industry in Washington, D.C., often addressing politicians who have little understanding of electronics technology.
CoWoS Drives Demand for Advanced Packaging Equipment; Sales Expected to Surpass 10% Growth in 2024
08/29/2024 | TrendForceTrendForce reveals that sales of advanced packaging equipment are expected to grow by more than 10% in 2024, with the potential to exceed 20% in 2025.
Nordson Electronics Solutions to Exhibit at SEMICON Taiwan 2024
08/28/2024 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516.
Why You Need to Take This New ‘Semiconductor Essentials’ Course
08/26/2024 | I-Connect007 Editorial TeamRecently, Andy Shaughnessy and Nolan Johnson met with Soo Lan Cheah, the developer of a new IPC course geared toward PCB manufacturing professionals who have little to no knowledge about semiconductor manufacturing. With her background in PCB and IC design, Soo Lan brings a circumspect vision of these disciplines and how they are inter-related. You don’t need to know a lot of math to take this course, and you’ll come out with a much better understanding of the whole silicon-to-systems approach.