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Altus Strengthens its Partnership with Active-PCB Solutions Through Further Investment in Koh Young Technology
August 21, 2024 | Altus GroupEstimated reading time: 1 minute
Altus Group, a leading supplier of capital equipment for the electronics manufacturing industry in the UK and Ireland, is pleased to announce the successful installation of a second Koh Young Zenith 3D Automated Optical Inspection (AOI) system at Active-PCB Solutions. This latest investment highlights Altus’ commitment to providing innovative solutions that enhance operational efficiency and quality in the Electronics Manufacturing Services sector.
Active-PCB Solutions, a leading contract electronics manufacturer, previously invested in the Koh Young Zenith Alpha HS+ AOI two years ago, achieving outstanding results with the initial system. Pleased with its performance, the company has now expanded its capabilities by adding a second unit. This new investment will further enhance their inspection processes, enabling comprehensive 3D inspection and meeting the demanding standards of modern electronics manufacturing.
Luke Minnis, Manufacturing Product and Process Engineer at Active-PCB, said: "I have been a Koh Young and Altus partner for many years now, and we are really happy to keep building on our partnership and to bring in another 3D AOI. This investment is a clear sign of our ambitions for the future and our desire to implement the best-in-class processes at our facility."
Anthony Oh, Technical Applications Manager at Altus Group, said: "It is always gratifying to receive repeat orders from our partners. This ultimately means the machine is generating the expected return on investment they had planned. Active-PCB is a significant player in the UK CEM space, so to have their continued trust and investment is something we are very proud of. We look forward to continuing to support them as they leverage the AOI platform to drive further improvements in their manufacturing processes."
The Koh Young Zenith Alpha HS+ is known for its high-speed, AI-driven 3D measurement capabilities. With a 4-projector setup using Digital Light Processing (DLP) technology, the system offers 15-micron resolution and full 3D metrology up to 25mm in height. These advanced features ensure precise and reliable inspection of complex assemblies, meeting rigorous quality standards.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
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IEMI 2026 in Bengaluru: Shaping the Next Era of Electronics
10/01/2025 | Arpita Das, Global Electronics AssociationIntegrated Electronics Manufacturing & Interconnections (IEMI) 2026, Jan. 29–30, at Taj Yeshwantpur, Bengaluru, builds on the success of IEMI 2024, which took place in both Kuala Lumpur and Bengaluru and attracted over 1,200 participants. From smart factory showcases to IPC-certified soldering competitions, it was a platform for knowledge exchange and technical engagement.
American Made Advocacy: Congress Back from Break With Work To Do
09/23/2025 | Shane Whiteside -- Column: American Made AdvocacyAs Washington wakes up after the August Congressional recess, leaders from both sides of the aisle confront a host of serious policy challenges. One of the challenges is reauthorizing the Defense Production Act (DPA), a U.S. law that gives the president broad authority to influence the domestic industrial base to support national defense and emergency preparedness.
The Power Shift in U.S. Manufacturing Ownership
08/20/2025 | Nolan Johnson, I-Connect007The U.S. manufacturing landscape is driven by reshoring initiatives, supply chain realignments, and a surge of foreign interest. What does that mean for U.S.-based PCB and EMS companies? In this interview, mergers and acquisitions expert Tom Kastner breaks down the forces reshaping the industry—why foreign investors are eager to enter the U.S. market, why many are evaluating greenfield facilities over acquisitions, and why the high-mix, low-volume focus of most domestic shops doesn’t always align with foreign buyers’ goals.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.