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SEMI, IESA Join to Strengthen Semiconductor Ecosystem at SEMICON India 2024

09/12/2024 | SEMI
In a strategic move to further solidify India's position in the global semiconductor value chain, SEMI®, the global industry association that connects the semiconductor and electronics design and manufacturing value chain, has announced a strategic agreement with the India Electronics and Semiconductor Association (IESA), the leading industry body representing the electronics and semiconductor sectors in India. 

Zuken Introduces Harness Builder 2025 for E3.series with Enhanced Integration and Documentation Capabilities

09/11/2024 | Zuken
Zuken, a global leader in electrical and electronic digital engineering solutions, is proud to unveil the 2025 version of its industry-leading Harness Builder for E3.series software. 

StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium

09/11/2024 | StratEdge
StratEdge Corporation announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.

Register Now for NEDME 2024

09/11/2024 | NEDME
The Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.

Beyond Design: Integrated Circuit to PCB Integration

09/11/2024 | Barry Olney -- Column: Beyond Design
Technologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
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