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Würth Elektronik at PEDC 2025

01/14/2025 | Wurth Elektronik
On January 29 to 30, 2025, the Pan-European Electronics Design Conference (PEDC) will convene leading experts from industry and research in Vienna.

The Chemical Connection: Can Changing Spray Nozzles Improve My Etch Quality?

01/13/2025 | Don Ball -- Column: The Chemical Connection
Whenever the need to improve etch quality due to tightening customer specifications arises, the inevitable question asked early on is, “Will going to a different type of nozzle or nozzle flow rate make my etch quality better?” Unfortunately, the answer is most likely, “Probably not.” (Sorry, folks.) So, why not?

Laser Photonics Propels R&D Efforts in PCB Depaneling

01/01/2025 | BUSINESS WIRE
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems (CMS Laser), announced the expansion of their Printed Circuit Board (PCB) Depaneling technology development project for the electronics market.

High-Generation Panel Production Expected to Drive OLED Notebook Penetration Rate Past 5% by 2027

12/20/2024 | TrendForce
TrendForce's latest OLED Technology and Market Development Report reveals that the penetration rate of OLED displays in notebooks is set to increase to 3% in 2024, driven by large-scale procurement from Chinese laptop brands. While growth in 2025 is expected to be moderate, the anticipated introduction of OLED displays in Apple’s MacBook lineup will mark a significant turning point.

Connect the Dots: Designing for Reality: Strip-Etch-Strip

12/05/2024 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we focused on pattern plating. At this point, we are close to completing our boards and ready for the strip-etch-strip (SES) process. By this stage of the manufacturing process, we have laminated all the internal layers together, drilled the through-holes, applied the image to the external layers through photoresist, plated the copper in those channels to beef up the copper thickness for traces, pads, and through-holes, added a layer of electrolytic tin over the top of that copper to protect it during subsequent stages of production.
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